PART |
Description |
Maker |
M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGD137W34DKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
F12396-11 |
COMPACT MCP ASSEMBLY SERIES
|
Hamamatsu Corporation
|
F2224-11M F2224-11P F2224-11S F2224-14 F2224-14M F |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics
|
Hamamatsu Corporation
|
RMK |
Thin Film Standard Resistive Network, Thin Film Technology, Ultra Film
|
Vishay
|
S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
S75WS256NDFBFWLJ3 S75WS256NDFBAWLK2 S75WS256NDFBFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
Spansion, Inc. SPANSION LLC
|
070906FS |
ULTRA THIN D-SUB STRAIGHT P.C.B MOUNT
|
SUYIN USA, INC.
|
HC1612 |
Ultra thin and small leadless type
|
auris-GmbH
|