PART |
Description |
Maker |
M6MGD137W34DKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Corporation
|
F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
F6589 |
ULTRA THIN MCP ASSEMBLY WITH CENTER HOLE
|
HAMAMATSU[Hamamatsu Corporation]
|
AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc. Spansion, Inc.
|
74270181 |
WE-TOF EMI Suppression Toroidal Ferrite
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
74270176 |
WE-TOF EMI Suppression Toroidal Ferrite
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
IRS1010C IRS1020C |
Most integrated and sophisticated Time-of-Flight (ToF) imager available on the market.
|
Infineon Technologies AG
|
S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品 Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc. Spansion, Inc.
|
DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP) Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http:// SPANSION[SPANSION] Spansion, Inc.
|
AM70PDL127BDH66IS AM70PDL127BDH66IT AM70PDL127BDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装(MCP / XIP)的快闪记忆体,数据存储的MirrorBit闪存和移动存储芯片(XIP)的 2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位)的CMOS 3.0伏特,只有页面模式闪存数据存28兆位米16位)的CMOS
|
Spansion, Inc. Spansion Inc.
|