| PART |
Description |
Maker |
| BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc.
AD[Analog Devices]
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| 1-54-712 1-54-724 1-54-716 1-54-732 1-54-708 |
HAMMER BALL PEIN 12OZ
HAMMER BALL PEIN 24OZ
HAMMER BALL PEIN 32OZ
HAMMER BALL PEIN 8OZ
HAMMER BALL PEIN 16OZ 锤球石工16安士
|
ITT, Corp.
|
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五（巴西）总裁| 12A条一（c）|47VAR
|
EPCOS AG
|
| 1SS269 |
Small packag Small Total capacitance: CT = 1.2pF(Max) Low series resistance: rs = 0.6(Typ.)
|
TY Semiconductor Co., Ltd
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| CA-PLCC32-Z-M-T-01 |
Carrier Adapter 32 Position PLCC ZIF Socket with test points to mini-grid array interface. Pin mapping is 1:1.
|
Ironwood Electronics.
|
| 0787884824 |
Milli-Grid Receptacle, Surface Mount, Vertical, Top Entry, without Plastic Pegs
|
Molex Electronics Ltd.
|
