| PART |
Description |
Maker |
| V54C3256164VALT6 V54C3256804VAT V54C3256404VAT V54 |
256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4 56Mbit SDRAM.3伏，第二的TSOP /系统芯片的BGA / WBGA包装16米x 162 × 84米4
|
Mosel Vitelic, Corp.
|
| HY5RS573225F |
256 GDDR3 SDRAM
|
Hynix Semiconductor
|
| K4S561632C-TC75 K4S561632C K4S561632C-L1H K4S56163 |
16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
IC,SDRAM,4X4MX16,CMOS,TSOP,54PIN,PLASTIC
256Mbit SDRAM 4M x 16bit x 4 Banks Synchronous DRAM
|
Samsung semiconductor
|
| H55S2562JFR-60M H55S2562JFR-75M H55S2562JFR-A3M |
256MBit MOBILE SDR SDRAM based on 4M x 4Bank x16 I/O
|
Hynix Semiconductor
|
| V54C3256164VAT V54C3256164VBT V54C3256404VB V54C32 |
256Mbit SDRAM 3.3 VOLT/ TSOP II / SOC BGA / WBGA PACKAGE 16M X 16/ 32M X 8/ 64M X 4
256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4
|
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
| K4D553238F-GC33 K4D553238F-GC36 K4D553238F-GC2A K4 |
256Mbit GDDR SDRAM 56Mbit GDDR SDRAM内存
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
|
| HYB18H256321BF-11/12/14 HYB18H256321BF-10 HYB18H25 |
256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM 8M X 32 SYNCHRONOUS GRAPHICS RAM MODULE, 0.21 ns, PBGA136
256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM 256兆GDDR3显卡内存GDDR3显卡内存
256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM 8M X 32 SYNCHRONOUS GRAPHICS RAM MODULE, 0.22 ns, PBGA136
|
Qimonda AG
|
| HYB18H1G321AF-10/11/14 |
GDDR3 Graphics RAM 1-Gbit GDDR3 Graphics RAM GDDR3显卡内存1千兆位GDDR3显卡内存
|
Qimonda AG
|
| HYB18H256321BF-10 HYB18H256321BF-11 HYB18H256321BF |
256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM
|
http://
Qimonda AG
|
| HYB18H256321AF-12 |
256-Mbit x32 GDDR3 DRAM
|
Infineon
|
| HYB18H512321BF-08_10 HYB18H512321BF HYB18H512321BF |
512-Mbit GDDR3 Graphics RAM
|
Qimonda AG
http://
|
