PART |
Description |
Maker |
21-0036 |
PACKAGE OUTLINE, 8L UMAX/USOP
|
Maxim Integrated Products
|
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
TDFN3X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT223-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|