| PART |
Description |
Maker |
| 21-0140 |
PACKAGE OUTLINE, 16,20,28,32,40L THIN QFN, 5*5*0.75MM
|
Maxim Integrated Products
|
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| LTC2296CUPPBF LTC2297IUPPBF LINEARTECHNOLOGYCORP-L |
Dual 14-Bit, 25Msps Low Power 3V ADCs; Package: QFN; No of Pins: 64; Temperature Range: 0°C to 70°C DUAL 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
Dual 14-Bit, 40Msps Low Power 3V ADCs; Package: QFN; No of Pins: 64; Temperature Range: -40°C to 85°C
Dual 14-Bit, 65Msps Low Power 3V ADCs; Package: QFN; No of Pins: 64; Temperature Range: -40°C to 85°C
Dual 14-Bit, 25Msps Low Power 3V ADCs; Package: QFN; No of Pins: 64; Temperature Range: -40°C to 85°C
|
Linear Technology, Corp.
LINEAR TECHNOLOGY CORP
|
| SOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
| WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
