| PART |
Description |
Maker |
| WEDPS512K32-12BC WEDPS512K32-12BI WEDPS512K32-12BM |
512Kx32 SRAM MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| WS512K32-45 WS512K32-20 WS512K32-25 WS512K32-17 WS |
512Kx32 SRAM Module(512Kx32静态RAM模块（存取时5ns
512Kx32 SRAM Module(512Kx32静态RAM模块（存取时0ns
512Kx32 SRAM Module(512Kx32静态RAM模块（存取时7ns
512Kx32 SRAM Module(512Kx32???RAM妯″?锛???????5ns锛?
|
White Electronic Designs Corporation
|
| WED2DL32512V38BC WED2DL32512V40BI WED2DL32512V40BC |
512Kx32 Synchronous Pipeline Burst SRAM
|
WEDC[White Electronic Designs Corporation]
|
| SM8R-67024EL-55FH SM8R-67024L-55FH AM4R-67024V-55 |
4K X 16 MULTI-PORT SRAM, 55 ns, CPGA85
4K X 16 MULTI-PORT SRAM, 55 ns, CQCC84
4K X 16 MULTI-PORT SRAM, 55 ns, PQCC84
4K X 16 MULTI-PORT SRAM, 35 ns, CQCC84
4K X 16 MULTI-PORT SRAM, 45 ns, PQFP84
|
HIROSE ELECTRIC Co., Ltd.
|
| TH50VSF3680 TH50VSF3681AASB TH50VSF368 |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA[Toshiba Semiconductor]
|
| AM49DL640AG AM49DL640AG70IS AM49DL640AG70IT AM49DL |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM42DL640AH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM49DL640BH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM50DL128CH70IS AM50DL128CH70IT AM50DL128CH85IS AM |
STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
|
AMD[Advanced Micro Devices]
|
| AM49DL640AG85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
