| PART |
Description |
Maker |
| B72510T1140S262 B72520T1140S262 B72500T1140S260 CT |
Multilayer technology
|
http://
EPCOS[EPCOS]
|
| B72580T0600S172 B72580T0950S172 B72580T6750K072 B7 |
Multilayer technology MLV; Telecom Series 多层技术反转录电信系列
|
EPCOS AG
|
| PIC18F4680 PIC18F2585 PIC18F2585_07 PIC18F2680 PIC |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
| SIGC81T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| PIC18F44800TI_SOQTP PIC18F44800TE_SOSQTP PIC18F448 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology 28/40/44-Pin增强型闪存微控制器与ECAN技术，10A / D和纳瓦技
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology 28/40/44-Pin增强型闪存微控制器与ECAN技术，10位A / D和纳瓦技
DEM9PB
|
Microchip Technology, Inc.
Microchip Technology Inc.
http://
|
| 0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
|
Presidio Components, Inc.
|
| B72588G3140S200 B72548G3140S200 B72587E3200K000 |
Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded
|
EPCOS AG
|
| CR1209X7R104Z3F5 CR1209X7R104Z3NG5 CR1209X7R104Z3F |
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 1209 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00047 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0056 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0022 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.0012 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.001 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0015 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
| HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics
Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers
ETC[ETC]
Hantronix,Inc
Electronic Theatre Controls, Inc.
|
| 2222207556 2238207556 2255207555 2250207555 222220 |
General Purpose & High Capacitance
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
This specification describes X7R series chip capacitors with lead-free terminations
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
|
YAGEO Corporation
List of Unclassifed Manufac...
|
| NMC0805Y5V105Z6.3TRP3KF NMC0603Y5V105Z6.3TRP3KF NM |
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 1 uF, SURFACE MOUNT, 0805
Multilayer Ceramic Chip Capacitors 多层陶瓷芯片电容
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 1 uF, SURFACE MOUNT, 1206
|
NIC Components Corp.
NIC Components, Corp.
|
| SIGC144T170R2C SIGC144T170R2C09 |
IGBT Chip in NPT-technology 1700V NPT technology 280 μm chip
|
Infineon Technologies AG
|
|
