PART |
Description |
Maker |
BCM4318 BCM1161 |
MOBILE VOIP PROCESSOR
|
Broadcom Corp. Broadcom Corporation.
|
BCM1160 |
Mobile VoIP Processor
|
Broadcom
|
AT76C901 |
Wireless VoIP Phone-Based on the 802.11 Standard Processor
|
Atmel
|
MSP2020 |
Service Processor MSP for Secure VoIP Gateways and Phones, Wired and Wireless Short Form
|
PMC-Sierra, Inc PMC-Serria
|
STN8810BDS12HPBE STN8810S12 |
STn8810 mobile multimedia application processor with 1-Gbit NAND-Flash and 512-Mbit DDR mobile RAM
|
STMicroelectronics
|
NJM2705 |
Surround Audio Processor for Mobile Applications
|
njr
|
PENTIUMIIIPROCESSOR |
32 bit Processor Mobile Module(32 位带移动模块处理
|
Intel Corp.
|
INTELPENTIUMIIPROCESSOR |
Pentium II Processor Mobile Module(带移动模块奔II处理
|
Intel Corp.
|
STV0984 STV0984_TR STV0984TR STV0984/TR |
2 MegaPixel SMIA Profile 2 Mobile Imaging Processor From old datasheet system
|
ST Microelectronics, Inc. STMicroelectronics
|
TBD |
Compact Board With Intel R 3rd Generation Core Tm i Series i7/i5/i3 Mobile Processor
|
AAEON Technology
|
HC55185GCM HC55185GCMZ HC55185GCR HC55185GCRZ HC55 |
VoIP Ringing SLIC; Temperature Range: -40°C to 85°C; Package: 28-PLCC T&R VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 28-PLCC T&R TELECOM-SLIC, PQCC28 VoIP Ringing SLIC; Temperature Range: 0°C to 70°C; Package: 32-QFN T&R TELECOM-SLIC, PQCC32 VoIP Ringing SLIC Family
|
Intersil, Corp. INTERSIL[Intersil Corporation]
|