| PART |
Description |
Maker |
| PE-52627 PE-52629 PE-52625 PE-52649 PE-52628 PE-52 |
LTC1701 Evaluation Kit
Standard Low Power Inductors - Switch Mode Power Converters and Ripple Filters
LTC1773EMS Evaluation Kit
LTC3401EMS10 Evaluation Kit
LTC1876 Evaluation Kit
LTC1960 Evaluation Kit
LTC1700EMS Evaluation Kit
3.3V Micropower EIA/TIA-562 Transceiver
LTC1771EMS8 Evaluation Kit 标准低功率电感器-开关电源转换器和过滤器纹波
|
Electronic Theatre Controls, Inc.
|
| W83627HF-PW W83627F W83627HF-AW |
WINBOND I/O
WINBOND I/O MULTIFUNCTION PERIPHERAL, PQFP128
|
Winbond Electronics, Corp.
Winbond Electronics Corp
|
| 25C040-P 25AA040-P 25LC040-P 25C040X-ST 25C040IN 2 |
Evaluation Kit for the MAX1748, MAX1779
Evaluation Kit for the MAX16803
Evaluation Kit for the MAX1760
High-Voltage, Step-Down DC-DC Controller in µMAX
500mA Low-Dropout Linear Regulator in UCSP
Industry-Standard, 12-Bit ADC with Reference
Evaluation Kit for the MAX1757, MAX1758
60mA, SOT23 Inverting Charge Pump with Shutdown
Evaluation Kit for the MAX1700, MAX1701
125mA, Frequency-Selectable, Switched-Capacitor Voltage Converters
Evaluation Kit for the MAX1684, MAX1685
Evaluation Kit for the MAX1698
Evaluation Kit for the MAX1692
Evaluation Kit for the MAX1703
Evaluation Kit for the MAX1820, MAX1821
Complete, 100ksps, 8-Channel, 12-Bit Data Acquisition Systems SPI串行EEPROM
High-Voltage, 350mA, Adjustable Linear High-Brightness LED (HB LED) Driver SPI串行EEPROM
Evaluation Kit for the MAX1744, MAX1745 SPI串行EEPROM
SPI Serial EEPROM SPI串行EEPROM
|
Microchip Technology, Inc.
|
| MAX1583XETB MAX1583YETB MAX1583ZETB MAX1583EVKIT M |
White LED Camera-Flash
MAX1583 Evaluation Kit
1 A, 24 V, evaluation kit
500 mA, 24 V, evaluation kit
250 mA, 24 V, evaluation kit
|
MAXIM - Dallas Semiconductor
|
| EV42-160-22-SERIES EV44-100-22-SERIES EV44-160-22- |
TLC2555 Evaluation Module
TLC4545 Evaluation Module
TLC2551 Evaluation Module
CC1000DK-868/915 MHz Development Kit
CC2400DK Development Kit
TPA0172 Evaluation Module
Radiomodem 433 MHz
CC2400DBK Demonstration Board Kit
CC1000PP 433 MHz Plug and Play Module
Digital Data Capture and Analysis for High Speed, High Resolution A to D Converters
ADS1244 Evaluation Module
SN65HVD22EVM Evaluation Module
Peripheral IC 外围芯片
|
Infineon Technologies AG
NXP Semiconductors N.V.
Amphenol, Corp.
Xicon Passive Components
Electronic Theatre Controls, Inc.
|
| W83793G |
Winbond H/W Monitor
|
http://
|
| W83L784AR |
WINBOND H/W MONITORING IC
|
WINBOND[Winbond]
|
| W83977A W83977ATF 977ATF |
From old datasheet system
WINBOND I/O
|
WINBOND[Winbond]
|
| W83977TF 977TF W83977TF98 |
From old datasheet system
WINBOND I/O
|
Winbond
|
| W55MID50 |
From old datasheet system
WINBOND MFID READER
|
Winbond Electronics Corp
|
