| PART |
Description |
Maker |
| LFBGA-H FBGA |
Fine Pitch Ball Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| 1565360-9 1565359 1565359-1 1565359-3 1565359-5 15 |
ON TAPING 0.5MM PITCH FINE MATE CONN. TAB ASSEMBLY
|
Tyco Electronics
|
| UPD70236AGD-20-5BB |
16-BIT, 20 MHz, MICROPROCESSOR, PQFP120 28 X 28 MM, FINE PITCH, PLASTIC, QFP-120
|
Merrimac Industries, Inc.
|
| UPD703014AYGC-XXX-8EU |
32-BIT, MROM, 20 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100
|
LEDtronics, Inc.
|
| ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五（巴西）总裁| 12A条一（c）|47VAR
|
EPCOS AG
|
| 24-5.02-030-002-829 24-5.02-034-003-829 24-5.02-02 |
Fine Pitch SMT Board to Board Connectors
|
AVX Corporation
|
| 5-6123468-0 |
.4mm, .5mm, .6mm, .8mm, Fine Pitch, Surface Mount, Stacking Bd-to-Bd Connectors; ON TAPING (EMBOSS) 0.5MM FS CONN TAB ASS ( Tyco Electronics )
|
Tyco Electronics
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
