PART |
Description |
Maker |
0475960132 |
0.9144mm (.036) by 0.9144mm (.036) Pitch LGA 1156 Desktop PC CPU Socket, 0.38μm (15μ) Gold (Au) Plating, with Pick-and-Place Cover, 1156Circuits, Leadfree
|
Molex Electronics Ltd.
|
2SJ555 |
0.036 ohm, POWER, FET Silicon P-Channel MOS FET
|
Hitachi Semiconductor
|
SC100..5.SERIES |
SCHOTTKY DIE 105 x 105 mils
|
International Rectifier
|
AM79C401JC |
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE) 协议控制
|
Panasonic Industrial Solutions
|
408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
SB090P125-W-AG |
Schottky Barrier Diode Wafer 90 Mils, 125 Volt, 8 Amp
|
TRANSYS Electronics Limited
|
SB073P200-W-AG SB073P200-W-AG_AL SB073P200-W-AG/AL |
Schottky Barrier Diode Wafer 73 Mils, 200 Volt, 5 Amp
|
TRANSYS Electronics Lim... TRANSYS Electronics Limited
|
SB073P125-W-AG SB073P125-W-AG_AL SB073P125-W-AG/AL |
Schottky Barrier Diode Wafer 73 Mils, 125 Volt, 5 Amp
|
TRANSYS Electronics Lim... TRANSYS Electronics Limited
|
SB051C020-1-W-AG |
Schottky cr Barrier Diode Wafer 51 Mils, 20 Volt, 1 Amp, 0.32VF.
|
TRANSYS Electronics Limited
|