| PART |
Description |
Maker |
| LTV819-2M LTV819-1M LTV819-1S LTV-829S-TA1 LTV-819 |
High Density Mounting Type Photocoupler 2 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
High Density Mounting Type Photocoupler(484.24 k) 高密度安装类型光电耦合84.24十一
1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
|
Lite-On Technology, Corp.
LITE-ON ELECTRONICS INC
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS
|
| PC829 PC849 |
High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| LTV847M-V LTV847-V LTV847S-V LTV-817 LTV817-V LTV8 |
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
|
| LTV817MV |
High Density Mounting Type Photocoupler
|
LITEON
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| CMJ206T |
TUNING FORK CRYSTAL UNIT (SMD - Jacket Type)
HIGH-DENSITY MOUNTING SMD WITH JACKET
|
CITIZEN ELECTRONICS CO., LTD.
List of Unclassifed Manufacturers
ETC
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSM88WA |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| IS2701-1 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
|
| TLP621-2 TLP621-4 TLP621 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
