|
|
|
http://
|
Part No. |
AN-9037
|
OCR Text |
...sumer electronics with tin lead solders was hot air solder leveled, hasl. with lead free, other finishes are preferred. immersion silver, immersion nickel gold and organic surface protectant, osp is the board finishes of choice. eac... |
Description |
8x8 MLP DriverMOS Packaging
|
File Size |
749.51K /
7 Page |
View
it Online |
Download Datasheet |
|
|
|
http://
|
Part No. |
AN-9040
|
OCR Text |
...sumer electronics with tin lead solders was hot air solder leveled, hasl. with lead free, other finishes are preferred. immersion silver, immersion nickel gold and organic surface protectant, osp are the board finishes of choice. ea... |
Description |
Power33 Packaging
|
File Size |
299.73K /
7 Page |
View
it Online |
Download Datasheet |
|
|
|
http://
|
Part No. |
AN-9048
|
OCR Text |
...sumer electronics with tin lead solders was hot air solder leveled, hasl. with lead free, other finishes are preferred. immersion silver, immersion nickel gold and organic surface protectant, osp are the board finishes of choice. ea... |
Description |
6x6 DriverMOS Packaging
|
File Size |
746.79K /
9 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|