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  multi-chip package memory 128m Datasheet PDF File

For multi-chip package memory 128m Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K5P2880YCM
Description multi-chip package memory 128m Bit 16Mx8 Nand Flash memory / 8M Bit 1Mx8/512Kx16 Full CMOS SRAM

File Size 556.18K  /  29 Page

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    K5P2880YCM

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K5P2880YCM
Description multi-chip package memory 128m Bit 16Mx8 Nand Flash memory / 8M Bit 1Mx8/512Kx16 Full CMOS SRAM

File Size 549.77K  /  29 Page

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    SPANSION[SPANSION]
Part No. MB84SF6H6H6L2-70PBS MB84SF6H6H6L2-70
Description 3 Stacked MCP (multi-chip package) FLASH & FLASH & FCRAM 128m (X16) Burst FLASH memory & 128m (X16) Page/Burst Mobile FCRAM

File Size 1,211.00K  /  100 Page

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    Spansion Inc.
Part No. MB84SF6H6H6L2-70 MB84SF6H6H6L2-70PBS
Description 3 Stacked MCP (multi-chip package) FLASH & FLASH & FCRAM 128m (X16) Burst FLASH memory & 128m (X16) Page/Burst Mobile FCRAM

File Size 1,253.42K  /  100 Page

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    RENESAS
Part No. M6MGD137W3 M6MGD137W33TP
Description The M6MGD137W33TP is a Stacked micro Multi Chip package (S- mMCP) that contents 128m-bit Flash memory and 32M-bit Mobile RAM in a 52-pin TSOP.

File Size 50.73K  /  3 Page

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    TOSHIBA
Part No. TH50VSF4682AASB TH50VSF4683AASB
Description multi-chip INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH memory MIXED multi-chip package

File Size 579.77K  /  55 Page

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    TOSHIBA
Part No. TH50VSF3582AASB
Description multi-chip INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH memory MIXED multi-chip package

File Size 540.52K  /  50 Page

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    TOSHIBA
Part No. TH50VPN564 TH50VPN5640EBSB
Description multi-chip INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM memory MIXED multi-chip package

File Size 650.61K  /  42 Page

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    Spansion Inc.
Spansion, Inc.
Part No. MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD21182EM-70PBS MB84VD21191EM-70PBS
Description Stacked MCP (multi-chip package) FLASH memory & SRAM CMOS
Stacked MCP (multi-chip package) FLASH memory & SRAM CMOS SPECIALTY memory CIRCUIT, PBGA56

File Size 313.99K  /  52 Page

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    http://
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K5A3240YTC-T855 K5A3340YBC-T855 K5A3240YBC-T855 K5A3340YTC-T855 K5A3340YTC-T755 K5A3240YTC-T755 K5A3340YBC-T755 K5A3240YBC-T755 K5A3340YBC-T7550 K5A3340YTC-T7550 K5A3240YBC-T8550
Description SPECIALTY memory CIRCUIT, PBGA69
multi-chip package memory 32M Bit (4Mx8/2Mx16) Dual Bank NOR Flash memory / 4M(512Kx8/256Kx16) Full CMOS SRAM

File Size 877.37K  /  45 Page

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For multi-chip package memory 128m Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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