|
|
 |
TDK
|
Part No. |
C8050X
|
OCR Text |
...dditions answer the electronics industrys need for higher density packaging. TDKs advanced technology allows for smaller size, highest capacitance, increased reliability, and automated assembly. Applications include computers and peripheral... |
Description |
Ceramic Chip
|
File Size |
598.59K /
7 Page |
View
it Online |
Download Datasheet
|
|
|
 |
TDK
|
Part No. |
C3216XXXX
|
OCR Text |
...dditions answer the electronics industrys need for higher density packaging. TDKs advanced technology allows for smaller size, highest capacitance, increased reliability, and automated assembly. Applications include computers and peripheral... |
Description |
Ceramic Chip
|
File Size |
580.57K /
7 Page |
View
it Online |
Download Datasheet
|
|
|
 |
Conexant Systems, Inc.
|
Part No. |
CX24130
|
OCR Text |
...lution conexants cx24130 is the industrys f rst single-chip dual-stream qpsk/ bpsk demodulator designed for satellite receiver systems. the device is ideal for applications such as personal video recorders (pvrs) that process dual incomin... |
Description |
Dual Stream QPSK/BPSK Demodulator lC
|
File Size |
190.02K /
2 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|