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flat ribbon Datasheet PDF File

For flat ribbon Found Datasheets File :: 1865 Search Time::0.984ms
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				MA-Com MACOM[Tyco Electronics]
Part No.	MASW20000
OCR Text	...age surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface ...ribbon (3.0 mil X 0.5 mil) may also be used.Thermosonic wire bonding with a nominal stage temperatur...
Description	DC-20 GHz GaAs SPDT switch GaAs SPDT Switch DC - 20 GHz
File Size	86.61K / 2 Page	View it Online	Download Datasheet

				LINER[Linear Technology]
Part No.	LTC1045 LTC1045CJ LTC1045CN LTC1045CSW 1045FB
OCR Text	.... TYPICAL APPLICATION 5V flat ribbon Cable Driver/Receiver 5V 20 TTL IN XMT IN + - V V+ 1 VOH VOL DIS 13 11 20 XMT OUT 66-FT flat ribbon CABLE ZO = 150 ADJACENT CONDUCTORS 150 RCV IN V+ 1 VOH VOL DIS 13 11 RCV OUT 1.4V ...
Description	From old datasheet system Programmable Micropower Hex Translator/Receiver/Driver Programmable Micropower Hex Translator/ Receiver/Driver
File Size	369.57K / 20 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC294
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon bond with 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is recommended. Thermosonic wirebonding ...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 25 - 40 GHz
File Size	171.55K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... HITTITE[Hittite Microwave Corporation]
Part No.	HMC331
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon are recommended. These bonds should be thermosonically bonded with a force of 40 - 60 grams. ...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER 12 - 18 GHz INPUT GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT
File Size	97.77K / 5 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC404
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C ...ribbon Bond (RF and LO ports) 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is recommended. Thermosonic...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED IRM MIXER/ 26 - 33 GHz GaAs MMIC SUB-HARMONICALLY PUMPED IRM MIXER, 26 - 33 GHz
File Size	234.76K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC281
OCR Text	...ing surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 de...ribbon bond (RF ports) with 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is recommended. Thermosonic w...
Description	GaAs MMIC LOW NOISE AMPLIFIER 18 - 32 GHz
File Size	103.55K / 6 Page	View it Online	Download Datasheet

For flat ribbon Found Datasheets File :: 1865 Search Time::0.984ms
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