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  bumps Datasheet PDF File

For bumps Found Datasheets File :: 2230    Search Time::2.031ms    
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    CM1203 CM1203-01CP CM1203-01CS CM1203-02CP CM1203-02CS CM1203-03CP CM1203-03CS

California Micro Devices Corporation
Part No. CM1203 CM1203-01CP CM1203-01CS CM1203-02CP CM1203-02CS CM1203-03CP CM1203-03CS
OCR Text ... / PINOUT DIAGRAMS TOP VIEW (bumps Down View) Orientation Marking (see note 2) BOTTOM VIEW (bumps Up View) A1 1 A B 2 A2 A1 B1 n* B2 Orientation Marking * See ordering information for appropriate part marking. C...
Description 1, 2 and 3-Channel ESD Arrays in CSP 1通道的ESD阵列的总警
1, 2 and 3-Channel ESD Protection Arrays in Chip Scale Package with OptiGuard™ Coating (CSPESD301/302/303 pin compatible)

File Size 239.54K  /  7 Page

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    SiGe Semiconductor Inc.
SIGE[SiGe Semiconductor, Inc.]
Part No. PA2423G-EV PA2423 PA2423G
OCR Text ...of the gold bump bare die (gold bumps on top surface). This view should be used for the chip-on-board mounting. The second drawing illustrates the side view of the die. 960m 20 m 2 600m 3 600m 4 600m 5 600 m 6 1000...
Description 2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information

File Size 214.45K  /  9 Page

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    PROTEC[Protek Devices]
Part No. LC0406FC36C LC0406FC LC0406FC05C LC0406FC08C LC0406FC12C LC0406FC15C LC0406FC24C LC0406FC3.3C
OCR Text ...0.028 0.039 0.020 DIE SOLDER bumps E H G 1. Preferred: Using 0.1mm (0.004") stencil. I SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK F Outline & Dimensions: Rev 3 - 11/02, 06023 05158.R5 4/05 5 www....
Description LOW CAPACITANCE FLIP CHIP ARRAY

File Size 113.55K  /  6 Page

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    PCF2104C PCF2104CU PCF2104CU_2 PCF2104CU_7 PCF2104L PCF2104LU PCF2104LU_7 PCF2104N PCF2104NU PCF2104NU_7

PHILIPS[Philips Semiconductors]
Part No. PCF2104C PCF2104CU PCF2104CU_2 PCF2104CU_7 PCF2104L PCF2104LU PCF2104LU_7 PCF2104N PCF2104NU PCF2104NU_7
OCR Text ...ONS * PCF2104xU/2; chip with bumps in tray * PCF2104xU/7; chip with bumps on tape. For further details see Chapter 18. 3.2 Available types * Telecom equipment * Portable instruments * Point-of-sale terminals. 3 GENERAL DESCRIPTION ...
Description LCD controller/driver

File Size 364.18K  /  56 Page

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    PROTEC[Protek Devices]
Part No. SFC05-4
OCR Text ...0.020 0.039 0.020 DIE SOLDER bumps C F E 1. Preferred: Using 0.1mm (0.004") stencil. B G SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK D Outline & Dimensions: Rev 0 - 10/02, 06039 05131.R6 4/05 5 ...
Description FLIP CHIP ARRAY

File Size 126.18K  /  6 Page

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    Littelfuse, Inc.
LITTELFUSE[Littelfuse]
Part No. SP0516BACT SP0504BACT SP0508BACT SP0504BAC
OCR Text ...8BACT SP0516BACT DIODE CHANNELS bumps 4 8 16 6 10 20 CS PACKAGE SIZE (MM) 1.804 x 1.154 3.104 x 1.154 3.104 x 2.454 QUANTITY PER REEL 3500 3500 3500 5 Features * An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Packa...
Description (SP0504BAC / SP0508BAC / SP0516BAC) Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package

File Size 152.54K  /  3 Page

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    LITTELFUSE[Littelfuse]
Part No. SP0516BBCT SP0504BBC SP0504BBCT SP0508BBC SP0508BBCT SP0516BBC
OCR Text ...04BBCT SP0508BBCT SP0516BBCT bumps 6 10 20 Features * An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale Package (0.65mm bump pitch) * ESD Capability per HBM Standards - IEC 61000-4-2, Direct Discharge ................
Description (SP0504BBC / SP0508BBC / SP0516BBC) SP0504BBCT - TVS Avalanche Diode Array in a Bipolar Chip Scale Package

File Size 167.33K  /  3 Page

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    PCA1604 PCA1604U PCA1604U_10 PCA1603 PCA1602 PCA1602T PCA1625 PCA1601 PCA1601U_10 PCA1611 PCA1611U PCA1608U PCA1608 PCA1

PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
Part No. PCA1604 PCA1604U PCA1604U_10 PCA1603 PCA1602 PCA1602T PCA1625 PCA1601 PCA1601U_10 PCA1611 PCA1611U PCA1608U PCA1608 PCA1604U/10 PCA1601U/10 PCA1605U/7 PCA1603U/7 PCA1621 PCA1622U PCA1625U/7 PCA1626U PCA1626U10 PCA1607U PCA1607 PCA1603UF1 PCA1604U10F1 PCA1604U10F2 PCA1605 PCA1606 PCA1606U/10 PCA1606U10F2 PCA1606UF2 PCA1605U7F2 PCA1622 PCA1622UF1 PCA1622UF2 PCA1623 PCA1623U/7 PCA1624U PCA1621U/10 PCA1621U/7 PCA1621U10F1 PCA1621U10F2 PCA1621U7F1 PCA1623U7F2 PCA1625U PCA1625U10F1 PCA1628 PCA1628U PCA1623U7F1 PCA1625U7F2 PCA1625UF2 PCA1627U PCA1627U/7 PCA1624 PCA1626 PCA1627 PCA1627U7F2 PCA1629 PCA1629U/7
OCR Text ...e; 8 leads (straight) chip with bumps on tape chip in tray chip on foil chip with bumps on tape chip on foil chip in tray chip in tray chip in tray chip with bumps on tape chip on foil chip in tray chip with bumps on tape chip in tray chip ...
Description 5015 RR 4#8 PIN RECP
Circular Connector; Body Material:Aluminum; Series:PT06; Number of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Circular Contact Gender:Socket; Insert Arrangement:14-19
32 kHz watch circuits with EEPROM STEPPING MOTOR WATCH, UUC8
32 kHz watch circuits with EEPROM STEPPING MOTOR WATCH, PDFP8

File Size 85.75K  /  16 Page

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    Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
Part No. VESD05C-FC1
OCR Text ...rconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic. 1 2 19120 Features * ESD protection to IEC 61...
Description Bidirectional ESD protection diodes in flip-chip 1005 size;
Flip Chip Protection Diode - Chip Size 0402

File Size 130.34K  /  5 Page

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    PCF8576C PCF8576CH PCF8576CT PCF8576CU PCF8576CU_10 PCF8576CU_12 PCF8576CU_5 PCF8576CU_7 PCF8576 PCF8576CU_2

PHILIPS[Philips Semiconductors]
Part No. PCF8576C PCF8576CH PCF8576CT PCF8576CU PCF8576CU_10 PCF8576CU_12 PCF8576CU_5 PCF8576CU_7 PCF8576 PCF8576CU_2
OCR Text ...C LQFP64 chip in tray chip with bumps in tray unsawn wafer chip with bumps on tape chip-on-film frame carrier chip with bumps on film frame carrier plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm DESCRIPTION plastic v...
Description Universal LCD driver for low multiplex rates

File Size 264.72K  /  44 Page

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