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Raytheon
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| Part No. |
RMWM38001
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| OCR Text |
...ent to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grou... |
| Description |
38 GHz mixer MMIC
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| File Size |
306.16K /
5 Page |
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it Online |
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| Part No. |
PV203-3F PV753-3F
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| OCR Text |
bonding interconnecting leads. the bottom of the ceramic chip has a heavy gold plating for bonding the coil to a substr ate. please note that the pv series can be made wit h special substrate geometries for flip chip bonding. the ... |
| Description |
UNSHIELDED, 10 uH - 20 uH, VARIABLE INDUCTOR, SMD
UNSHIELDED, 38 uH - 75 uH, VARIABLE INDUCTOR, SMD
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| File Size |
83.08K /
3 Page |
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it Online |
Download Datasheet |
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Raytheon
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| Part No. |
RMWP38001
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| OCR Text |
...ent to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grou... |
| Description |
37-40 GHz power amplifier MMIC
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| File Size |
311.25K /
6 Page |
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it Online |
Download Datasheet |
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Raytheon RF Components
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| Part No. |
RMWL05001
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| OCR Text |
...ent to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grou... |
| Description |
5 GHZ Low Noise Amplifier Mmic
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| File Size |
440.71K /
6 Page |
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it Online |
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Winbond Electronics Corp
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| Part No. |
W55RFS27T1BH
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| OCR Text |
...................... 8 3.4.1 bonding p ad li st ............................................................................................................... ..........8 3.4.2 bonding p ad diagr am .................................... |
| Description |
SUPER-REGENERATION RF TRANSMITTER
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| File Size |
337.08K /
17 Page |
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it Online |
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Raytheon
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| Part No. |
RMWL05001
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| OCR Text |
...ent to prevent contamination of bonding surfaces. these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. all die attach and wire/ribbon bond equipment must be well grou... |
| Description |
5 GHz low noise amplifier MMIC
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| File Size |
407.26K /
6 Page |
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it Online |
Download Datasheet |
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Renesas
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| Part No. |
RJP1CS07DWT RJP1CS07DWA
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| OCR Text |
...tice. definition al pattern bonding area final passivation 10.5 8.85 1.31 7.48 1.88 0.81 1.45 10.5 1.88 1.88 1.88 1.45 emitter bonding pad (1) emitter bonding pad (4) emitter bonding pad (3) emitter bonding pad (2) gate bonding pad un... |
| Description |
IGBT
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| File Size |
126.01K /
4 Page |
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it Online |
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MSI
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| Part No. |
EMSBC
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| OCR Text |
...tachment to the substrate. wire bonding is made to the notched pad on top of the chip. emsbc's epoxy attachment to the substrate. wire bonding is made to the notched pad on top of the chip. emsbc's epoxy attachment to the substrate. wire bo... |
| Description |
THIN FILM EMSBC SERIES
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| File Size |
42.02K /
1 Page |
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it Online |
Download Datasheet |
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Price and Availability
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