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  87825-1011 Datasheet PDF File

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    87825-1011 0878251011

Molex Electronics Ltd.
Part No. 87825-1011 0878251011
Description 1.27mm (.050) Pitch DDR DIMM Socket, 25 Degree Angle, Through Hole, 2.5V Right Voltage Keys, 3.18mm(.125) Tail Length, 100 Circuits

File Size 283.84K  /  6 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87825-1001 0878251001

Molex Electronics Ltd.
Part No. 87825-1001 0878251001
Description 1.27mm (.050) Pitch DDR DIMM Socket, 25 Degree Angle, Through Hole, 2.5V Right Voltage Keys, 2.79mm(.110) Tail Length, 100 Circuits

File Size 283.83K  /  6 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Integrated Circuit Technology Corp
Part No. MZTK06N1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, RECTANGULAR

File Size 81.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    ITT, Corp.
Part No. MZCK03P1011/KS35D
Description MAGNETIC FIELD SENSOR-MAGNETORESISTIVE, 4-4mT, 200mA, PA66

File Size 81.18K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    03-06-1011

Molex Electronics Ltd.
Part No. 03-06-1011
Description 1.57mm Diameter Standard .062 Pin and Socket Receptacle Housing, 1 Circuits

File Size 30.14K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    03-06-1011-P

Molex Electronics Ltd.
Part No. 03-06-1011-P
Description PLUG & RECEPTACLE HOUSINGS I CIRCUIT

File Size 113.41K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    03-09-1011

Molex Electronics Ltd.
Part No. 03-09-1011
Description 2.36mm Diameter Standard

File Size 30.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    EM-1011

Asahi Kasei Microsystems
Part No. EM-1011
Description EM-1011 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC

File Size 129.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    MULTI CONTACT AG
Part No. 23.1011-23
Description INTERCONNECTION DEVICE

File Size 163.40K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    VOF-10 VOF-10-12 VOF-10-15 VOF-10-24 VOF-10-3.3 VOF-10-48 VOF-10-5 VOF-10-9 VOF-1011

CUI INC,
Part No. VOF-10 VOF-10-12 VOF-10-15 VOF-10-24 VOF-10-3.3 VOF-10-48 VOF-10-5 VOF-10-9 VOF-1011
Description AC-DC POWER SUPPLY

File Size 199.17K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

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