| |
|
 |
Amphenol Communications Solutions |
| Part No. |
89891-448HLF
|
| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 96 Positions, 2.54mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
86837-448HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
87052-448HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69133-448HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
69157-448HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
78233-448HLF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54mm (0.100in)Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
HONGFA[Hongfa Technology]
厦门宏发电声股份有限公司
Xiamen Hongfa Electroacoustic Co., Ltd.
???瀹???靛０?′唤??????
|
| Part No. |
JE10 JE1046ZTL2R JE10112HL1 JE10112HL1R JE10112HL2 JE10112HL2R JE10112HSL1 JE10112HSL1R JE10112HSL2 JE10112HSL2R JE10112HSTL1 JE10112HSTL1R JE10112HSTL2 JE10112HSTL2R JE10112HTL1 JE10112HTL1R JE10112HTL2 JE10112HTL2R JE10112ZL1 JE10112ZL1R JE10112ZL2 JE10112ZL2R JE10112ZSL1 JE10112ZSL1R JE10112ZSL2 JE10112ZSL2R JE10112ZSTL1 JE10112ZSTL1R JE10112ZSTL2 JE10112ZSTL2R JE10112ZTL1 JE10112ZTL1R JE10112ZTL2 JE10112ZTL2R JE10124HL1 JE10124HL1R JE10124HL2 JE10124HL2R JE10124HSL1 JE10124HSL1R JE10124HSL2 JE10124HSL2R JE10124HSTL1 JE10124HSTL1R JE10124HSTL2 JE10124HSTL2R JE10124HTL1 JE10124HTL1R JE10124HTL2 JE10124HTL2R JE10124ZL1 JE10124ZL1R JE10124ZL2 JE10124ZL2R JE10124ZSL1 JE10124ZSL1R JE10124ZSL2 JE10124ZSL2R JE10124ZSTL1 JE10124ZSTL1R JE10124ZSTL2 JE10124ZSTL2R JE10124ZTL1 JE10124ZTL1R JE10124ZTL2 JE10124ZTL2R JE10148HL1 JE10148HL1R JE10148HL2 JE10148HL2R JE10148HSL1 JE10148HSL1R JE10148HSL2 JE10148HSL2R JE10148HSTL1 JE10148HSTL1R JE10148HSTL2 JE10148HSTL2R JE10148HTL1 JE10148HTL1R JE10148HTL2 JE10148HTL2R JE10148ZL1 JE10148ZL1R JE10148ZL2 JE10148ZL2R JE10148ZSL1 JE10148ZSL1R JE10148ZSL2 JE10148ZSL2R JE10148ZSTL1 JE10148ZSTL1R JE10148ZSTL2 JE10148ZSTL2R JE10148ZTL1 JE10148ZTL1R JE10148Z
|
| Description |
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.1pF; Voltage: 100V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±1%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
MINIATURE HIGH POWER LATCHING RELAY 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.2pF; Voltage: 50V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
MINIATURE HIGH POWER LATCHING RELAY
|
| File Size |
64.89K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
86840-448HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 4481 |
| Maker: SI |
| Pack: SOP8P |
| Stock: 12 |
| Unit price
for : |
|
50: $0.37 |
|
100: $0.35 |
| 1000:
$0.33 |
|
Email: oulindz@gmail.com |
|
Contact us |
|
|
