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wirebond Datasheet PDF File

For wirebond Found Datasheets File :: 255 Search Time::0.735ms
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				ON Semiconductor
Part No.	NBSG11 NBSG111 NBSG11BA NBSG53A NBSG53ABA NBSG53AMN NBSG53AMNR2 NBSG86A NBSG86ABA
OCR Text	...to the package substrate by the wirebond method (figure 1), or by the flipchip direct attachment method (figure 2). the csp, pbga, and fcbga are the most common bga package types. a chip scale package (csp) can have either wirebond or flipc...
Description	2.5 V/3.3 V SiGe 1:2 Differential Clock Driver with RSECL Outputs 2.5 V/3.3 V SiGe 1:10 Differential Clock Driver with RSECL Outputs 2.5 V/3.3 V SiGe Selectable Differential Clock and Data D Flip-Flop/Clock Divider with Reset and OLS 2.5 V/3.3 V SiGe Differential Smart Gate with Output Level Select
File Size	57.39K / 8 Page	View it Online	Download Datasheet

				sirenza.com
Part No.	SFT-0100
OCR Text	... a 0.1uf capacitor is required. wirebond length is critical and should be minimized. c vcc : an off chip bypass capacitor is required. wirebond length is critical and should be minimized. ground wirebonds: the sft-0100 has backside via...
Description	Transimpedance Amplifier
File Size	157.96K / 4 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRLHS2242TR2PBF IRLHS2242PBF IRLHS2242TRPBF
OCR Text	...us drain current, v gs @ 4.5v (wirebond limited) i dm pulsed drain current
Description	HEXFET Power MOSFET
File Size	279.74K / 9 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MJF15030-D MJF15031
OCR Text	...(volts) 5 200 5 3 10 2 0.1 0.03 wirebond limit thermal limit secondary breakdown limit @ t c = 25 c 10 30 50 70 1 0.02 100 2720 0.05 0.2 0.3 0.5 150 there are two limitations on the power handling ability of a transistor: average junctio...
Description	Complementary Power Transistors For Isolated Package Applications Power 8A 150V NPN Power 8A 150V PNP
File Size	117.36K / 8 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	P2010 P2020
OCR Text	...o signals ? pac kage: 689-pin wirebond power-bga (tepbga2) freescale, qoriq, corenet and the freescale logo are trademarks or registered trademarks of freescale semiconductor, inc. in the u.s. and other countries. all other product or...
Description	single- and dual-core communications processors
File Size	173.59K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	LX3044 LX3046 LX3045
OCR Text	...receiver benefits large wirebond contact pads low contact resistance product highlight coplanar design (gnd-signal-gnd) 50 ohm characteristic impedance 125 um standard pad pitch for ease of test large 75um x ...
Description	(LX3044 - LX3046) GAAS Pin Photo Detectors
File Size	277.97K / 5 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	P1012 P1021 P1021NXE2HFB P1021NSE2HFB
OCR Text	... signals ? package: 689-pin wirebond power-bga (tepbga2)
Description	P1012 and P1021 single- and dual-core communications processors
File Size	239.35K / 2 Page	View it Online	Download Datasheet

For wirebond Found Datasheets File :: 255 Search Time::0.735ms
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