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wafer-carrier Datasheet PDF File

For wafer-carrier Found Datasheets File :: 936 Search Time::3.593ms
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				Raytheon
Part No.	RMWP38001
OCR Text	... ghz power amplifier typical on-wafer measurements i dq = 250 ma v dd = 4 v 0 2 4 6 8 10 12 14 16 18 20 22 24 26 35 35.5 36 36.5 37 37.5 38 38.5 39 39.5 40 frequency (ghz) s21 mag (db) -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 s 1...
Description	37-40 GHz power amplifier MMIC
File Size	311.25K / 6 Page	View it Online	Download Datasheet

				MICROCHIP[Microchip Technology]
Part No.	MCRF202-I_WQ99 MCRF202 MCRF202-I_P MCRF202-I_S MCRF202-I_SB MCRF202-I_SN MCRF202-I_W MCRF202-I_WB MCRF202-I_WF MCRF202-I_WFB
OCR Text	...Biphase Manchester Biphase Die, Wafer, PDIP or SOIC package option Factory programming and device serialization Package Type PDIP/SOIC ...carrier signal that is transmitted from the reader. When the device develops sufficient DC voltage, ...
Description	The MCRF202 is a passive Radio Frequency Identification (RFID) IC device with an external sensor Input that provides an RF interface for reading the contents of a user memory array. The MCRF202 is specially designed to detect the logic sta 125 kHz Passive RFID Device with Sensor Input From old datasheet system
File Size	245.97K / 20 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TGA4832-EPU
OCR Text	...ice is 100% dc and rf tested on-wafer to ensure performance compliance. the device is available in die form. measured performance bias condi...carrier) vds = 2.5 v* i d = 135 ma pdiss = 0.34 w 92 64 1.5 e+7 * vds = 2.5v across common ga...
Description	DC - 35 GHz Wideband Low Noise Amplifier
File Size	243.19K / 10 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	MF0ICU2 MF0ICU2001DUD MF0ICU2101DUD MF0MOU2101DA4 MF0MOU2001DA4
OCR Text	...pe number Description 8 inch wafer (sawn, laser diced; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format)[1] 8 inch wafer (sawn, laser diced; 120 m thickness, on film frame carrier; electronic...
Description	MIFARE Ultralight C
File Size	68.31K / 15 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	HTSMOH5601EV HTSH4801ETK HTSH5601ETK HTSFCH5601EV HTSICH5601EW HTSICC4801EW HTSICH4801EW
OCR Text	... types ? sawn, gold - bumped 8? wafer ? sawn, gold - megabumped 8? wafer ? contactless chip card module moa2 ? i ? connect (low cost flip c...carrier package; 35 mm wide tape sot500-3 htsmoh4801ev pllmc [1] 2048 bit plastic leadless module c...
Description	HITAG S transponder IC SPECIALTY TELECOM CIRCUIT, UUC
File Size	107.86K / 21 Page	View it Online	Download Datasheet

				EMMICRO[EM Microelectronic - MARIN SA]
Part No.	H4006501IC H4006 H4006501CID H4006501COB
OCR Text	...oned as followed (see table 5): Wafer Number Factory reserved IC name Customer ID Extended lot number IC position Cyclic redundancy check Start and stop bits First bit sent is bit 0. 5 bits 4 bits 10 bits 13 bits 18 bits 14 bits 16 bits 2 b...
Description	13.56MHz 64 Data bit Read Only Contactless Identification Device
File Size	253.90K / 10 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	AND8002 AND8002D
OCR Text	...ation Traceability Code Code 6. Wafer Lot Traceability Code Code 7. Year Date Code Code 8. Work Week Date Code Code 2 Temperature Compensat...Carrier Plastic Leaded Chip Carrier Ceramic DIP EIAJ Small Outline IC Quad Flat No-Lead Ceramic DIP ...
Description	ECLinPS, ECLinPS Lite, ECLinPS Plus ECLinPS MAX, and GigaComm Marking and Ordering Information Guide
File Size	134.01K / 16 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	MF1S5009DUD MF1S5009DA4
OCR Text	...elivery options * Bumped die on wafer * MOA4 contactless module 2. Features and benefits 2.1 MIFARE RF Interface (ISO/IEC 14443 A) Cont...carrier, electronic fail die marking according to SECS-II format) plastic leadless module carrier pa...
Description	Mainstream contactless smart card IC for fast and easy solution development
File Size	250.06K / 32 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard... Agilent (Hewlett-Packard) HP[Agilent(Hewlett-Packard)] Avago Technologies, Ltd.
Part No.	HMPP-389X HMPP-3890-BLK HMPP-3890-TR1 HMPP-3890-TR2 HMPP-3892-BLK HMPP-3892-TR1 HMPP-3892-TR2 HMPP-3895-BLK HMPP-3895-TR1 HMPP-3895-TR2 HMPP-389T-BLK HMPP-389T-TR1 HMPP-389T-TR2 DEMO-HMPP-38X0 DEMO-HMPP-389T HMPP-389T
OCR Text	...aken from adjacent sites on the wafer, assuring the highest degree of match. The HMPP-389T low inductance wide band shunt switch is well sui...Carrier Lifetime (ns) 200 IF = 10 mA IR = 6 mA Total Capacitance CT (pF) 0.20 @ 5 V 2 HMPP-38...
Description	HMPP-389T · MiniPak PIN switch diode HMPP-3895 · MiniPak PIN switch diode HMPP-3892 · MiniPak PIN switch diode HMPP-3890 · MiniPak PIN switch diode DEMO-HMPP-389T · Demonstration circuit board for HMPP-389T DEMO-HMPP-38X0 · Demonstration circuit board for the HMPP-3860 and HMPP-3890 MiniPak Surface Mount RF PIN Switch Diodes MiniPak表面贴装射频PIN开关二极管 MiniPak PIN switch diode MiniPak PIN开关二极管
File Size	152.35K / 11 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRG4CC71KB
OCR Text	Wafer Form C 600 V Size 7.1 Ultra-Fast Speed Circuit Rated Rated G E 6" Wafer Electrical Characteristics ( Wafer Form ) Param...carrier tape are intended for immediate use and have a limited shelf life. This is primarily due to ...
Description	IRG4CC71KB IGBT Die in Wafer Form
File Size	75.92K / 2 Page	View it Online	Download Datasheet

For wafer-carrier Found Datasheets File :: 936 Search Time::3.593ms
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