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LG
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Part No. |
LEMwS68T80KZXXXX
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OCR Text |
... package : 6.0 3.0 0.8 mm (l w h) - viewing angle : 118? - chip material : ingan - soldering method : reflow soldering - ...emboss tape : conductive ps (black) - cover tape : conductive pet base ? reel ? tape ... |
Description |
6030 2Cup 2Chip
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File Size |
748.33K /
12 Page |
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it Online |
Download Datasheet
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Advanced Ceramic X
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Part No. |
DM3030
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OCR Text |
...r module ? dimensions ( l w ) 3.0 3.0 mm ? material code w ? frequency range 2455=2400mhz /5500mhz ? specification...emboss tape t c O O trailer end empty compartments with cover tape (500 mm min.) t... |
Description |
Multilayer Chip Diplexer Module
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File Size |
197.23K /
9 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation
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Part No. |
RQK0605JGDQA-15
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OCR Text |
...el dissipation pch note2 0.8 w channel temperature tch 150 c storage temperature tstg ?55 to +150 c notes: 1. pw 10 s, dut...emboss taping
notice 1. descriptions of circuits, software and other related information in ... |
Description |
Silicon N Channel MOS FET Power Switching
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File Size |
167.75K /
8 Page |
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it Online |
Download Datasheet
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Price and Availability
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