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  perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 991    Search Time::0.875ms    
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    HMC499

HITTITE[Hittite Microwave Corporation]
Part No. HMC499
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 21 - 32 GHz

File Size 215.15K  /  8 Page

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    ILX551A

Sony Corporation
Part No. ILX551A
OCR Text ...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Upper ceramic layer 39N 29N 29N , , 0.9Nm Lower ceramic...
Description From old datasheet system
2048-pixel CCD Linear Sensor (B/W)

File Size 128.93K  /  10 Page

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    Agilent (Hewlett-Packard)
Part No. ACMD-7401
OCR Text ...r) should be provided under the perimeter of the duplexer, as shown in Figure 15. The rectangular opening in the center of the duplexer ground plane (Figure 15) is strongly suggested. The 5 mm x 5 mm miniature FBAR duplexer has two via hole...
Description ACMD-7401 · 5 x 5 mm FBAR Duplexer for US PCS Band

File Size 307.95K  /  12 Page

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    HMC256

Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
Part No. HMC256
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 37 Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire...
Description    GaAs MMIC I/Q MIXER 5.9 - 12 GHz
600000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN

File Size 142.83K  /  6 Page

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    HMC265

HITTITE[Hittite Microwave Corporation]
Part No. HMC265
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 63 Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire...
Description GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz
GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER/ 20 - 32 GHz

File Size 217.48K  /  6 Page

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    ILX569K

Sony Corporation
Part No. ILX569K
OCR Text ...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Cover glass Plastic portion 39N 29N 29N 0.9Nm Ceramic portion (1) ...
Description 5340-pixel x 6 line CCD Linear Sensor (Color)
From old datasheet system

File Size 112.33K  /  13 Page

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    ILX724KA

Sony Corporation
Part No. ILX724KA
OCR Text ...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm , , , Cover glass Plastic portion 39N 29N 29N 0.9Nm Ceramic p...
Description 2700-pixel X 3 line CCD Linear Sensor (Color)

File Size 132.15K  /  12 Page

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    ILX724K

Sony Corporation
Part No. ILX724K
OCR Text ...ore than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm b) In addition, if a load is applied to the entire surface by a hard compone...
Description 2700 X 3pixel CCD Linear Sensor (Color)

File Size 180.20K  /  12 Page

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    HMC292

Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
Part No. HMC292
OCR Text ...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 75 Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. Thes...
Description GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 32 GHz
GaAs MMIC DOUBLE-BALANCED MIXER 18 - 32 GHz
GaAs MMIC DOUBLE-BALANCED MIXER/ 18 - 32 GHz

File Size 164.85K  /  6 Page

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    MASW4030G

MA-Com
MACOM[Tyco Electronics]
Part No. MASW4030G
OCR Text ...et should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used but is not required. Maximum Ratings A. Control Value (A or B): B. Max Input RF Po...
Description DC-4 GHz GaAs DPDT switch
GaAs SPDT Switch DC - 4 GHz

File Size 161.88K  /  2 Page

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