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SGS Thomson Microelectronics
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| Part No. |
AN577
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| OCR Text |
...athode lead oriented toward the perforated side of the film.
In compliance with EIA 481-1 and IEC 286-3 specifications. AN577/0298 1/4
APPLICATION NOTE
SOLDERING METHODS : SMD devices are suitable for mounting on various substrates ... |
| Description |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE
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| File Size |
40.73K /
4 Page |
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THAT Corporation
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| Part No. |
THAT1200-DEMO
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| OCR Text |
...ns, spare circuit board area is perforated with plated through holes. this makes this board particularly useful for experimentation. with a that1200 demonstration system and standard audio cables, an engineer can begin evaluating the perfor... |
| Description |
Line Receiver IC Demonstration System
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| File Size |
56.10K /
2 Page |
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it Online |
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Samsung Electronics
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| Part No. |
CL05CXXXX
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| OCR Text |
...unit:mm a b feeding round holes perforated square holes for inserting a chip d p0 p1 p2 w f e t
multilayer ceramic capacitor - high frequency - 13 - taping size empty section 45 pitch packed part empty section 50 pitch loading section 35... |
| Description |
(CL Series) Multilayer Ceramic Capacitor
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| File Size |
550.87K /
29 Page |
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it Online |
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CEL[California Eastern Labs]
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| Part No. |
UPC2749TB-E3-A UPC2749TB
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| OCR Text |
...8 mm wide. Pins 1, 2 and 3 face perforated side of tape.
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expe... |
| Description |
3 V, SUPER MINIMOLD 1900 MHz SI RFIC AMPLIFIER
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| File Size |
129.21K /
7 Page |
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it Online |
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Solidtron
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| Part No. |
SMCTTA20N20A10
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| OCR Text |
...s. the thinpak tm package is a perforated, metalized ceramic substrate attached to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior metal surfaces are ... |
| Description |
Power Management
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| File Size |
145.02K /
4 Page |
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it Online |
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Solidtron
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| Part No. |
SMCTTA32N14A10
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| OCR Text |
...s. the thinpak tm package is a perforated, metalized ceramic substrate attached to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior metal surfaces are ... |
| Description |
Advanced Pulse Power Device N-MOS VCS
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| File Size |
703.62K /
5 Page |
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it Online |
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Solidtron
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| Part No. |
SMCTTA65N14A10
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| OCR Text |
...s. the thinpak tm package is a perforated, metalized ceramic substrate attached to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior metal surfaces are ... |
| Description |
Power Management
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| File Size |
208.69K /
5 Page |
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it Online |
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NEC Corp.
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| Part No. |
PA831TF
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| OCR Text |
...tter), and pin 4 (q2 base) face perforated side of tape. pin configuration (top view) the information in this document is subject to change without notice.
2 m m m m pa831tf absolute maximum ratings (t a = 25 c) rating q1 q2 colle... |
| Description |
NPN Silicon Epitaxial Transisitor(NPN外延晶体
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| File Size |
68.77K /
12 Page |
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it Online |
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