|
|
|
California Micro Devices
|
Part No. |
CSPESD304
|
OCR Text |
...p package top view bottom view (bumps down view) (bumps up view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. part numbering information bumps package ... |
Description |
4-Channel ESD Array in CSP
|
File Size |
316.47K /
6 Page |
View
it Online |
Download Datasheet |
|
|
|
California Micro Devices
|
Part No. |
CSPESD301
|
OCR Text |
...1/302/303 top view bottom view (bumps down view) (bumps up view) * see ordering information for appropriate part marking. 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side or... |
Description |
1 / 2 and 3-Channel ESD Arrays in CSP
|
File Size |
447.52K /
7 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|