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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA2204DR2 MMA2204D
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| OCR Text |
... and a CMOS signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g-cell is a mechanical structure formed from s... |
| Description |
Surface Mount Micromachined Accelerometer
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| File Size |
150.34K /
8 Page |
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it Online |
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FREESCALE SEMICONDUCTOR INC
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| Part No. |
MMA1200KEGR2
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| OCR Text |
...and a cmos signal conditioning asic contained in a single integrated circuit package. the sensing element is sealed hermetically at the wafer level using a bulk micromachined ?cap'' wafer. the g-cell is a mechanical structure formed from... |
| Description |
SPECIALTY ANALOG CIRCUIT, PDSO16
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| File Size |
126.75K /
10 Page |
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it Online |
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Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola, Inc]
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| Part No. |
MMA2200W MMA1201P
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| OCR Text |
... by the accelerometer's control ASIC and a proportional output voltage results. This procedure assures that both the mechanical (g-cell) and electronic sections of the accelerometer are functioning. Ratiometricity Ratiometricity simply mean... |
| Description |
MICROMACHINED ACCELEROMETER SPECIALTY ANALOG CIRCUIT, PDIP16
MMA1201P Micromachined Accelerometer
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| File Size |
267.36K /
8 Page |
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it Online |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA1270EGR2 MMA1270EG
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| OCR Text |
... and a CMOS signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g-cell is a mechanical structure formed from s... |
| Description |
Low G Micromachined Accelerometer
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| File Size |
224.95K /
9 Page |
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it Online |
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Kawasaki
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| Part No. |
KL5KUSB201
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| OCR Text |
... 17 9.4. usb201 and hs_sie asic ip 19 9.4.1 hs_sie asic ip 19 9.4.2 usb201 asic ip 20 10. references 21
kawasaki usb device kl5kusb201 datasheet (digest) rev 1.1e page 5/21... |
| Description |
USB2.0 Compliant Transceiver Chip
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| File Size |
211.75K /
21 Page |
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it Online |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA1260EGR2 MMA1260 MMA1260D MMA1260EG
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| OCR Text |
... and a CMOS signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g-cell is a mechanical structure formed from s... |
| Description |
Low G Micromachined Accelerometer
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| File Size |
231.27K /
9 Page |
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it Online |
Download Datasheet |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MMA1260EGR2 MMA1260EG
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| OCR Text |
... and a CMOS signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g-cell is a mechanical structure formed from s... |
| Description |
Low G Micromachined Accelerometer
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| File Size |
234.09K /
9 Page |
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it Online |
Download Datasheet |
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