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  90136-2309 Datasheet PDF File

For 90136-2309 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    STK6875 2309

Sanyo Semicon Device
Part No. STK6875 2309
Description SPECIALTY ANALOG CIRCUIT, PSFM16
From old datasheet system
Thick FiLm Hybird IC
Thick Film Hybrid IC Bidirectional DC Brush-type Motor Driver (Io max = 5A)

File Size 189.76K  /  7 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TLP2309
Description Photocoupler (photo-IC output), 1 Mbps, 3750 Vrms, 5pin SO6
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CXD2309 CXD2309Q

SONY[Sony Corporation]
Part No. CXD2309 CXD2309Q
Description 10-bit 50MSPS RGB 3-channel D/A Converter

File Size 241.41K  /  16 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    STS2309A

SamHop Microelectronics Corp.
Part No. STS2309A
Description P -Channel Enhancement Mode Field Effect Transistor

File Size 652.66K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    PT230909

Princeton Technology Corp
Part No. PT230909
Description Headphone Driver IC

File Size 252.83K  /  8 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    HT162309 HT1623

Holtek Semiconductor Inc
Part No. HT162309 HT1623
Description RAM Mapping 488 LCD Controller for I/O MCU

File Size 131.53K  /  15 Page

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Amphenol Communications Solutions

Part No. 65823-093
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    KI2309DS

Guangdong Kexin Industrial Co.,Ltd
Part No. KI2309DS
Description P-Channel 60-V (D-S) MOSFET

File Size 46.80K  /  2 Page

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Amphenol Communications Solutions

Part No. 72309-8023RLF
Description USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
Tech specs    

Official Product Page

    Advanced Power Electronics
Part No. AP2309GN
Description P-CHANNEL ENHANCEMENT MODE POWER MOSFET

File Size 98.01K  /  4 Page

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Amphenol Communications Solutions

Part No. 72309-7033RPLF
Description USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
Tech specs    

Official Product Page

    SI2309DS

Vishay Siliconix
Part No. SI2309DS
Description P-Channel 60-V (D-S) MOSFET

File Size 37.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 68402-309LF
Description Dubox, Board to board connector, PCB Mounted Receptacle, Surface Mount, Dual Entry, Single Row, 9 Position, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HMC52309

Hittite Microwave Corporation
Part No. HMC52309
Description GaAs MMIC I/Q MIXER 15 - 23.6 GHz

File Size 245.04K  /  6 Page

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Amphenol Communications Solutions

Part No. 72309-5044RLF
Description UNIV SERIAL BUS DOUBLE D
Tech specs    

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    AP2309GN

Advanced Power Electronics Corp.
Part No. AP2309GN
Description P-CHANNEL ENHANCEMENT MODE POWER MOSFET

File Size 68.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 72309-7013BLF
Description USB 2.0, Input Output Connector, Double Deck Receptacle, Type A, Through Hole, Right Angle, 8 Positions
Tech specs    

Official Product Page

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