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  66181-101 Datasheet PDF File

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    1014-2

Microsemi Corporation
Part No. 1014-2
Description 2 Watt - 28 Volts, Class C Microwave 1000 - 1400 MHz

File Size 28.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10156618-1500LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 15 positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    22-28-5101

Molex Electronics Ltd.
Part No. 22-28-5101
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, Tin (Sn) Plating, Mating Pin Length 8.13mm (.320), with Kinked PC Tails

File Size 522.39K  /  36 Page

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Amphenol Communications Solutions

Part No. 10156618-1200LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 12 positions
Tech specs    

Official Product Page

    22-29-2101

Molex Electronics Ltd.
Part No. 22-29-2101
Description KK? 254 Wire-to-Board Header, Vertical, with Friction Lock, 10 Circuits, Gold (Au) Plating

File Size 44.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10156618-1300LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 13 positions
Tech specs    

Official Product Page

    22-28-1101

Molex Electronics Ltd.
Part No. 22-28-1101
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Friction Lock, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 311.15K  /  8 Page

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Amphenol Communications Solutions

Part No. 10156618-1000LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 10 positions
Tech specs    

Official Product Page

    14-56-4101

Molex Electronics Ltd.
Part No. 14-56-4101
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 0.76μm (30μ) Gold (Au), 10 Circuits

File Size 153.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6618-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    CE-3101

TDK Electronics
Part No. CE-3101
Description DC-DC Converter

File Size 52.76K  /  2 Page

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Amphenol Communications Solutions

Part No. 10156618-1600LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 16 positons
Tech specs    

Official Product Page

    ITS-3101-SP

Glenair, Inc.
Part No. ITS-3101-SP
Description    In-Line Cylindrical Receptacle Assembly

File Size 172.69K  /  2 Page

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Amphenol Communications Solutions

Part No. 10156618-1400LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 14 positions
Tech specs    

Official Product Page

    List of Unclassifed Man...
Part No. SK-1015
Description SNAP-IN MOUNTING

File Size 120.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 10156618-1100LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 11 positions
Tech specs    

Official Product Page

    MD-010 MD-0101

Vectron International, Inc
Part No. MD-010 MD-0101
Description Disciplined Oscillator Module

File Size 784.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-6618-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    CE-3101

TDK Electronics
TDK Corporation
TDK Semiconductor
Part No. CE-3101
Description Non-insulation, 8-pin SMD type, 1.2W output DC-DC Converter
DC to DC Converter, DC-DC Converter

File Size 26.60K  /  2 Page

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