Description |
10MS, 8 EIAJ SOIC, ind temp, GREEN, 2.7V(BIOS FLASH) 10MS, 8 SOIC, ind temp, GREEN, 2.7V(BIOS FLASH) DIE SALE, 2.7V, 7 MIL(BIOS FLASH) 10MS, 8 SAP, ind, ROHS-B, 2.7V(BIOS FLASH) 8-SOIC,AUTO temp,2.7V(SERIAL EE) 10MS, 8 PDIP, ind temp, 2.7V(SERIAL EE) 10MS, 8 PDIP, EXT temp, GREEN,2.7V(SERIAL EE) 10MS, 8 TSSOP, INT temp, GREEN, 1.8V(SERIAL EE) 10MS, 8 PDIP, INT temp, GREEN, 2.7V(SERIAL EE) 10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE) 10MS, 8 PDIP, ind temp, GREEN, 2.7V(SERIAL EE) 10MS, 8 PDIP, ind temp, GREEN,2.7V(SERIAL EE) 8 ULTRA THIN,MINI MAP,PB/HALO FREE,ind T(SERIAL EE) 现场可编程门阵列(FPGA 10MS, 8 SOIC, EXT temp, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列(FPGA Field Programmable Gate Array (FPGA) 现场可编程门阵列(FPGA 10MS, 8 SOIC, INT temp, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列(FPGA 10MS, 8 PDIP, EXT temp, GREEN, 2.7V(SERIAL EE)
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