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  1355-2 Datasheet PDF File

For 1355-2 Found Datasheets File :: 119+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 |   

   
Part No. HCNW4502300 HCNW4503300 HCNW135500 HCNW135300
Description npn型输出DC -输入光耦合
NPN-OUTPUT DC-INPUT OPTOCOUPLER

File Size 508.45K  /  16 Page

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Amphenol Communications Solutions

Part No. 10135584-644402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    CY7C1355C CY7C1355C-100AC CY7C1357C-133AC CY7C1357C-133AI CY7C1355C-133AC CY7C1355C-133AI ICY7C1357C-100BGI CY7C1355C-10

CYPRESS[Cypress Semiconductor]
Part No. CY7C1355C CY7C1355C-100AC CY7C1357C-133AC CY7C1357C-133AI CY7C1355C-133AC CY7C1355C-133AI ICY7C1357C-100BGI CY7C1355C-100AI CY7C1355C-100BGC CY7C1355C-100BGI CY7C1355C-100BZC CY7C1355C-100BZI CY7C1355C-117AC CY7C1355C-117AI CY7C1355C-117BGC CY7C1355C-117BGI CY7C1355C-117BZC CY7C1355C-117BZI CY7C1355C-133BGC CY7C1355C-133BGI CY7C1355C-133BZC CY7C1355C-133BZI CY7C1357C CY7C1357C-100AC CY7C1357C-100AI CY7C1357C-100BGC CY7C1357C-100BZC CY7C1357C-100BZI CY7C1357C-117AC CY7C1357C-117AI CY7C1357C-117BGC CY7C1357C-117BGI CY7C1357C-117BZC CY7C1357C-117BZI CY7C1357C-133BGC CY7C1357C-133BGI CY7C1357C-133BZC CY7C1357C-133BZI
Description 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture

File Size 477.65K  /  32 Page

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Amphenol Communications Solutions

Part No. 10135562-107500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine 2-pair, 13 column, 7.5mm stacking height, 104contacts
Tech specs    

Official Product Page

    R5F21354MDFP R5F21354MNFP R5F21355MDFP R5F21355MNFP

Renesas Electronics Corporation
Part No. R5F21354MDFP R5F21354MNFP R5F21355MDFP R5F21355MNFP
Description The R8C/35M Group of single-chip MCUs incorporates the R8C CPU core

File Size 516.31K  /  57 Page

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Amphenol Communications Solutions

Part No. 10135570-107500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine 4-pair, 7 column, 7.5mm stacking height, 98contacts
Tech specs    

Official Product Page

    CY7C1357C-100BZC CY7C1357C-100BZI CY7C1357C-100BZXC CY7C1357C-100BZXI CY7C1357C-133BGC CY7C1357C-133BGI CY7C1355C-100AXI

Cypress Semiconductor
Part No. CY7C1357C-100BZC CY7C1357C-100BZI CY7C1357C-100BZXC CY7C1357C-100BZXI CY7C1357C-133BGC CY7C1357C-133BGI CY7C1355C-100AXI CY7C1355C-100BGXI CY7C1355C-100AXC CY7C1355C-100BGXC CY7C1355C-100BGC CY7C1355C-100BGI CY7C1355C-100BZC CY7C1355C-100BZI CY7C1355C-100BZXC CY7C1355C-100BZXI CY7C1357C-133AXC CY7C1357C-133AXI CY7C1357C-133BGXC CY7C1357C-133BGXI CY7C1357C-133BZXC CY7C1357C-133BZXI CY7C1355C-133AXC CY7C1355C-133AXI CY7C1357C-100AXI CY7C1357C-100AXC CY7C1355C-133BGXI
Description 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL垄芒 Architecture
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL Architecture
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL?/a> Architecture

File Size 509.71K  /  28 Page

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Amphenol Communications Solutions

Part No. 10135564-127500ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 2 pair, 19 column, 152 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs    

Official Product Page

    Cypress Semiconductor Corp.
Cypress Semiconductor, Corp.
Part No. CY7C1355C-100AXC CY7C1355C-100BGXC CY7C1355C-133AXC CY7C1355C-100AXI CY7C1355C-100BZXI CY7C1355C-133AXI CY7C1355C-100BGXI CY7C1355C-100BZXC CY7C1355C-133BGXC CY7C1357C-100BGXC CY7C1357C-100BGXI CY7C1357C-133BGXC CY7C1357C-100BGC CY7C1357C-100BGI CY7C1357C-133BGC CY7C1357C-133BGI CY7C1355C-133BGXI CY7C1355C-133BZXC CY7C1355C-133BZXI CY7C1357C-100AXI CY7C1357C-100AXC CY7C1357C-100BZI CY7C1357C-133BZC CY7C1357C-133BZI CY7C1357C-133BZXC CY7C1357C-133BZXI CY7C1357C-100BZXC CY7C1357C-133BGXI
Description 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBLArchitecture 512K X 18 ZBT SRAM, 7.5 ns, PBGA165
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBLArchitecture 512K X 18 ZBT SRAM, 6.5 ns, PBGA165
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBLArchitecture 512K X 18 ZBT SRAM, 6.5 ns, PBGA119
9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL??Architecture

File Size 450.94K  /  28 Page

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Amphenol Communications Solutions

Part No. 10135574-119500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Mezzanine, 4-pair, 19 column, 19.5mm.
Tech specs    

Official Product Page

    EPCOS[EPCOS]
Part No. B32326-A6805 B32326 B32326-A1106 B32326-A1126 B32326-A1136 B32326-A1146 B32326-A1156 B32326-A1166 B32326-A1205 B32326-A1206 B32326-A1255 B32326-A1256 B32326-A1305 B32326-A1306 B32326-A1325 B32326-A1355 B32326-A1356 B32326-A1405 B32326-A1406 B32326-A1455 B32326-A1456 B32326-A1505 B32326-A1555 B32326-A1605 B32326-A1705 B32326-A1805 B32326-A1905 B32326-A6106 B32326-A6205 B32326-A6305 B32326-A6405 B32326-A6505 B32326-A6605
Description AC Film Capacitors Lighting

File Size 328.25K  /  5 Page

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Amphenol Communications Solutions

Part No. 10135583-642402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Receptacle, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs    

Official Product Page

    MB91350A MB91F355A MB91F355APMT-002 MB91F356B MB91F354A MB91F356BPMT MB91355APMT MB91354APMT

Fujitsu Component Limited.
Part No. MB91350A MB91F355A MB91F355APMT-002 MB91F356B MB91F354A MB91F356BPMT MB91355APMT MB91354APMT
Description 32-Bit Proprietary Microcontroller

File Size 490.82K  /  111 Page

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Amphenol Communications Solutions

Part No. 10135560-119500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine 2-pair, 7 column, 19.5mm stacking height, 56contacts
Tech specs    

Official Product Page

    EPCOS AG
EPCOS[EPCOS]
Part No. B32427-A6805 B32427 B32427-A1106 B32427-A1126 B32427-A1136 B32427-A1146 B32427-A1156 B32427-A1166 B32427-A1186 B32427-A1205 B32427-A1206 B32427-A1226 B32427-A1255 B32427-A1256 B32427-A1305 B32427-A1306 B32427-A1325 B32427-A1355 B32427-A1356 B32427-A1405 B32427-A1406 B32427-A1455 B32427-A1456 B32427-A1505 B32427-A1605 B32427-A1655 B32427-A1705 B32427-A1805 B32427-A1845 B32427-A1905 B32427-A6106 B32427-A6205 B32427-A6305 B32427-A6405 B32427-A6505 B32427-A6605 EPCOSAG-B32427-A6605 EPCOSAG-B32427-A6106 EPCOSAG-B32427-A1456
Description AC Film Capacitors Lighting 交流薄膜电容器照

File Size 198.95K  /  5 Page

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Amphenol Communications Solutions

Part No. 10135563-122500ULF
Description ExaMEZZ® 56Gb/s High Speed Mezzanine 2-pair, 15 column, 22.5mm stacking height, 120contacts
Tech specs    

Official Product Page

    MB91350A MB91354APMT MB91355APMT MB91V350A MB91F354A MB91F355A MB91F355APMT-002 MB91F356B MB91F356BPMT

FUJITSU[Fujitsu Media Devices Limited]
Part No. MB91350A MB91354APMT MB91355APMT MB91V350A MB91F354A MB91F355A MB91F355APMT-002 MB91F356B MB91F356BPMT
Description 32-Bit Proprietary Microcontroller

File Size 458.54K  /  111 Page

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Amphenol Communications Solutions

Part No. 10135562-111500ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 2 pair, 13 column, 104 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs    

Official Product Page

    R5F21355DNFP R5F21356DNFP R5F21354DNFP R5F21354DDFP R5F21356DDFP R5F21355DDFP

Renesas Electronics Corporation
Part No. R5F21355DNFP R5F21356DNFP R5F21354DNFP R5F21354DDFP R5F21356DDFP R5F21355DDFP
Description RENESAS MCU

File Size 400.05K  /  46 Page

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Amphenol Communications Solutions

Part No. 10135572-114400ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 13 column, 182 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs    

Official Product Page

For 1355-2 Found Datasheets File :: 119+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 |   

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