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  XG8S-0331 Datasheet PDF File

For XG8S-0331 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0901303314 90130-3314

Molex Electronics Ltd.
Part No. 0901303314 90130-3314
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Rochester Electronics LLC

Part No. 100331/VYA
Description 100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901303316 90130-3316

Molex Electronics Ltd.
Part No. 0901303316 90130-3316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    0901303318 90130-3318

Molex Electronics Ltd.
Part No. 0901303318 90130-3318
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    0026033191 26-03-3191

Molex Electronics Ltd.
Part No. 0026033191 26-03-3191
Description 3.96mm (.156") Pitch KK庐 Crimp Terminal Housing - Use With Trifurcon庐 Terminals, 19 Circuits
3.96mm (.156) Pitch KK? Crimp Terminal Housing - Use With Trifurcon? Terminals, 19 Circuits

File Size 412.81K  /  4 Page

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Amphenol Communications Solutions

Part No. 10106813-033112LF
Description 0.5 mm Pitch Hermaphroditic Mezzanine Connector, 30 positions, Standard length with pegs and hold-downs, Half of mated height equals 3 mm
Tech specs    

Official Product Page

    85003-3110 0850033110

Molex Electronics Ltd.
Part No. 85003-3110 0850033110
Description 2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole

File Size 62.04K  /  3 Page

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Amphenol Communications Solutions

Part No. 74033-103LF
Description 74033-103LF-BLACK 30AU LF
Tech specs    

Official Product Page

    85003-3122 0850033122

Molex Electronics Ltd.
Part No. 85003-3122 0850033122
Description 2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole0.60渭m (24渭") Selective Gold (Au) Plating, 64 Circuits, without Mounting Clips, No
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole0.60μm (24μ) Selective Gold (Au) Plating, 64 Circuits, without Mounting Clips, No FluxProof

File Size 60.34K  /  3 Page

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Amphenol Communications Solutions

Part No. UE86L462700331
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4SFP EXP PRT LRGR LP DIA.
Tech specs    

Official Product Page

    85003-3134 0850033134

Molex Electronics Ltd.
Part No. 85003-3134 0850033134
Description 2.54mm (.100") Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole

File Size 68.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-331HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 31 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    Wurth Elektronik GmbH & Co....
Part No. 7447480331
Description WE-TI Radial Leaded Wire Wound Inductor

File Size 971.82K  /  6 Page

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Amphenol Communications Solutions

Part No. 68033-115HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    RADIALL S A
Part No. R574303310
Description 0 MHz - 3000 MHz RF/MICROWAVE SGL POLE TRIPLE THROW SWITCH, 0.2 dB INSERTION LOSS

File Size 103.17K  /  2 Page

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Amphenol Communications Solutions

Part No. 10136647-033121LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 0026033101
Description 10 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP

File Size 26.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 68033-135HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

For XG8S-0331 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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