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HF
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| Part No. |
JQX-115F-T
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| OCR Text |
...ge distance 10mm * Sealed IP67& unsealed types available File No.:CQC02001001951
CONTACT DATA
Contact Arrangement Initial Contact Resistance Max. Contact Material Max. switching voltage Max. switching current 1A, 1C 50m (at 1A/ 6VDC) Se... |
| Description |
MINIATURE HIGH POWER RELAY
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| File Size |
236.56K /
2 Page |
 View
it Online |
Download Datasheet
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Vishay
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| Part No. |
REC-14LH REC-16LH
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| OCR Text |
...esolution * Easy Mounting These unsealed sensors are suitable for installation in the high pressure chamber of cylinders.
Vishay Sfernice
ELECTRICAL SPECIFICATIONS
Theoretical electrical travel (TET = E) Independent linearity over TE... |
| Description |
Precision Linear Transducers, Designed for Mounting in Hydraulic or Pneumatic Cylinder, Conductive Plastic Element, unsealed, Designed for High Pressure Chamber of Cylinders, High Accuracy, Very Good Repeatability
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| File Size |
119.77K /
2 Page |
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it Online |
Download Datasheet |
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Mitsubishi Electric
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| Part No. |
FU-450SDF-L4M70B
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| OCR Text |
...ge conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use i... |
| Description |
DFB-LD MODULE
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| File Size |
106.57K /
4 Page |
View
it Online |
Download Datasheet |
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Mitsubishi Electric
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| Part No. |
FU-450SDF-FW41M13B
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| OCR Text |
...ge conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use i... |
| Description |
DFB-LD MODULE
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| File Size |
103.12K /
4 Page |
View
it Online |
Download Datasheet |
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Mitsubishi Electric
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| Part No. |
FU-318AP
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| OCR Text |
...ge conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use i... |
| Description |
APD MODULE
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| File Size |
118.16K /
3 Page |
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it Online |
Download Datasheet |
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Mitsubishi Electric
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| Part No. |
FU-185SDF-E1M1
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| OCR Text |
...ge conditions for bare chip and unsealed products shall be stated separately because bare chip and unsealed products require stricter controls than package sealed products.
4. Design Conditions and Environment under Use:
(1) Avoid use i... |
| Description |
DFB-LD
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| File Size |
162.10K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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