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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 882 Search Time::1.625ms
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				Sony, Corp. Sony Corporation
Part No.	ILX103A
OCR Text	...ore than 0.5mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm Upper ceramic layer 39N 29N 29N 0.9Nm Lower ceramic layer ...
Description	3000-pixel CCD Linear Image Sensor (B/W) 3000像素CCD线性图像传感器（黑/白）
File Size	98.75K / 12 Page	View it Online	Download Datasheet

				ETC ZCOMM[Z-Communications, Inc]
Part No.	PSA3005A
OCR Text	...ius of all 24 half holes at the perimeter of the board are plated to provide a surface for the attachment of the PLL Module to the PCB. 16 pads are for grounding, 8 pads are for signal interface. The surface of the shield is tin-plated and ...
Description	PHASE LOCKED LOOP From old datasheet system
File Size	72.14K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... HITTITE[Hittite Microwave Corporation] 美国讯泰微波有限公司上海代表
Part No.	HMC361
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description	GaAs HBT MMIC DIVIDE-BY-2, DC - 11.0 GHz From old datasheet system Prescaler 600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs HBT MMIC DIVIDE-BY-2/ DC - 11.0 GHz
File Size	197.79K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC460
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC LOW NOISE AMPLIFIER, DC - 20.0 GHz
File Size	278.40K / 8 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC462
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 2.0 - 20.0 GHz
File Size	190.85K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC463
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC LOW NOISE AMPLIFIER, DC - 20.0 GHz
File Size	275.75K / 8 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC464
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC POWER AMPLIFIER, 2.0 - 20.0 GHz
File Size	230.46K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC465
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 20.0 GHz
File Size	285.41K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC490
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description	GaAs PHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER/ 12 - 17 GHz GaAs PHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER, 12 - 17 GHz
File Size	214.90K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC498
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description	GaAs PHEMT MMIC POWER AMPLIFIER/ 17 - 24 GHz GaAs PHEMT MMIC POWER AMPLIFIER, 17 - 24 GHz
File Size	207.55K / 8 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 882 Search Time::1.625ms
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