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TOSHIBA
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Part No. |
TPCC8106
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OCR Text |
...atures features (1) small, thin package (2) low drain-source on-resistance: r ds(on) = 9.5 m ? (typ.) (v gs = -10 v) (3) low leakage curr...glass-epoxy board (a), figure 5.1 note 3: device mounted on a glass-epoxy board (b), figure 5.2 note... |
Description |
Power MOSFET (P-ch single)
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File Size |
235.38K /
9 Page |
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it Online |
Download Datasheet
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MICROSEMI[Microsemi Corporation]
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Part No. |
1N4948 1N4942_04
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OCR Text |
...series where surface mount MELF package configurations are also available by adding a "US" suffix (see separate data sheet for 1N5615US thru...glass package Triple-Layer Passivation Internal "Category I" Metallurgical bonds Working Peak Revers... |
Description |
VOIDLESS-HERMETICALLY SEALED FAST RECOVERY GLASS RECTIFIERS
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File Size |
180.40K /
2 Page |
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it Online |
Download Datasheet
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Price and Availability
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