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    Infineon Technologies
Part No. LBC873-L1
OCR Text ...: luminous intensity * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering * preconditioning: acc. to JEDEC Level 2 * taping: 8 mm tape with 2000/reel, o180 mm or 8000/reel, o330 mm * ESD-withsta...
Description LED UNI-COLOR BLUE 470NM T/R

File Size 91.21K  /  10 Page

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    Infineon
Part No. LBY876-K1L2-1 LBY876-J1K1-1
OCR Text ...: luminous intensity * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering and TTW soldering * preconditioning: acc. to JEDEC Level 2 * taping: 8 mm tape with 3000/reel, o180 mm or 10000/reel, o3...
Description Micro SIDELED, blue, colorless clear

File Size 106.63K  /  13 Page

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    Xilinx, Inc.
Part No. XQ4025E-3HQ196N XQ4028EX-3HQ196N XQ4028E-3HQ196N XQ4005E-3HQ196N XQ4013E-3HQ196N XQ4010E-3HQ196N XQ4013EX-3HQ196N XQ4010EX-3HQ196N XQ4005EX-3HQ196N XQ4025EX-3HQ196N XQ4005EX-3CB196M XQ4005EX-3CB196N XQ4013EX-3CB196N XQ4025EX-3CB196N XQ4010EX-3CB196M XQ4013EX-3CB196M XQ4028EX-3CB196N XQ4010EX-3CB196N XQ4025EX-3CB196M XQ4028EX-3CB196M XQ4005E-4HQ196M XQ4005E-4HQ196N XQ4013E-4HQ196M XQ4025E-4HQ196N XQ4028E-4HQ196N XQ4013EX-4HQ196N XQ4010E-4HQ196N XQ4025E-4HQ196M XQ4005EX-4HQ196M XQ4010EX-4HQ196M XQ4028EX-4HQ196N XQ4010EX-4HQ196N XQ4013E-4HQ196N XQ4028E-4HQ196M XQ4013EX-4HQ196M XQ4025EX-4HQ196M XQ4028EX-4HQ196M XQ4010E-4HQ196M XQ4005EX-4HQ196N XQ4025EX-4HQ196N XQ4010EX-4HQ191N XQ4028EX-4HQ191N XQ4005EX-4HQ191M XQ4010EX-4HQ191M XQ4013EX-4HQ191N XQ4025EX-4HQ191M XQ4005EX-4HQ191N XQ4013EX-4HQ191M XQ4025EX-4HQ191N XQ4028EX-4HQ191M XQ4005EX-3CB191M XQ4013EX-3CB191N XQ4005EX-4BG191M XQ4005EX-4BG196M XQ4005EX-4BG196N XQ4010EX-4BG191M XQ4010EX-4BG196M XQ4010EX-4BG196N XQ4013EX-4BG191M XQ4013EX-4BG191N XQ4013EX-4BG196M XQ4013EX-4BG196N XQ4025EX-4BG191M XQ4025EX-4BG191N XQ4010EX-3CB191M XQ4010EX-4BG191N XQ4005EX-4BG191N XQ4005EX-3CB191N XQ4010EX-3CB191N XQ4013EX-3CB191M XQ4013E-4BG196M XQ4013E-3
OCR Text ...meters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values where one g...
Description QML High-Reliability FPGAs QML第高可靠性的FPGA

File Size 280.39K  /  36 Page

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    Panasonic
Part No. ERJ1GEF472C ERJ8EXXXXX ERJ-12XXXXX ERJ8EN ERJ6RXXXXX ERJ1TN ERJ6RE ERJ6RB ERJ1TXXXXX ERJ3RXXXXX ERJ1RXXXXX ERJ3RB ERJ14XXXXX ERJGXXXXX
OCR Text ....5 % Code C X V Packaging Methods Packaging Pressed Carrier Taping 2 mm pitch (1R) Punched Carrier Taping 2 mm pitch (2R) Punched Carrier Taping (3R, 6R) Resistance Value The first three digits are significant figures of resistance...
Description Precision Thick Film Chip Resistors

File Size 177.49K  /  6 Page

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    DCR1673SA DCR1673SA27

Dynex Semiconductor
Part No. DCR1673SA DCR1673SA27
OCR Text ...customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium hea...
Description Phase Control Thyristor

File Size 91.77K  /  8 Page

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    DMS935E2

Panasonic Semiconductor
Part No. DMS935E2
OCR Text ...V mV MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Pulse measurement CCD load device Parameter Pinchi off current Output impedance Symbol IP ZO Condition...
Description Silicon NPN epitaxial planar type

File Size 515.02K  /  5 Page

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    DMS935E1

Panasonic Semiconductor
Part No. DMS935E1
OCR Text ...V mV MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Pulse measurement CCD load device Parameter Pinchi off current Output impedance Symbol IP ZO Condition...
Description Silicon NPN epitaxial planar type

File Size 514.54K  /  5 Page

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    LGL29K-F2J1-24 LGL29K-G2J1-24 LGL29K-F2H1-24

Osram Opto Semiconductors GmbH
OSRAM GmbH
Part No. LGL29K-F2J1-24 LGL29K-G2J1-24 LGL29K-F2H1-24
OCR Text ...: luminous intensity * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering and TTW soldering * preconditioning: acc. to JEDEC Level 2 * taping: 8 mm tape with 5000/reel resp. 10000/reel, o180 mm ...
Description SmartLED0603 Hyper-Bright Low Current LED Lead (Pb) Free Product - RoHS Compliant SmartLED603超亮度低电流LED无铅(Pb)免费的产品-符合RoHS
SmartLED??0603 Hyper-Bright Low Current LED Lead (Pb) Free Product - RoHS Compliant

File Size 227.05K  /  14 Page

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    IE-703107-MC-EM1

NEC
Part No. IE-703107-MC-EM1
OCR Text ...ic specifications and operation methods broadly Read this manual in the order listed in CONTENTS. To know the operation methods and command functions of the IE-V850E-MC-A and IE-703107-MC-EM1 Read the user's manual of the debugger (separa...
Description V850E/MA1 in-circuit emulator

File Size 1,087.25K  /  81 Page

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    LDW5SN-3T4U-35 LBW5SN-FZHX-25 LBW5SN-GZJX-35 LDW5SN-1T2U-35

Osram Opto Semiconductors GmbH
OSRAM GmbH
Part No. LDW5SN-3T4U-35 LBW5SN-FZHX-25 LBW5SN-GZJX-35 LDW5SN-1T2U-35
OCR Text ...ength, radiant power * assembly methods: suitable for all SMT assembly methods * soldering methods: IR reflow soldering * preconditioning: acc. to JEDEC Level 2 * taping: 24-mm tape with 800/reel, o180 mm * ESD-withstand voltage: up to 2 kV...
Description Platinum DRAGONLead (Pb) Free Product - RoHS Compliant 白金龙㈢无铅(Pb)免费的产品-符合RoHS

File Size 297.82K  /  20 Page

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