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AMI[AMI SEMICONDUCTOR]
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| Part No. |
AMIS-722402
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| OCR Text |
...lect Resolution 1 (SR1) 2400dpi L 1200dpi L 600dpi H 300dpi H Select Resolution 2 (SR2) L H L H
4.0 Functional Description
4.1 Input / O...die length and width are given in the above sensor die figure 3. Pad locations are listed in the Pad... |
| Description |
Contact Image Sensor
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| File Size |
643.19K /
15 Page |
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Infineon
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| Part No. |
SPL2Y85
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| OCR Text |
...zahnmedizinische anwendungen ? l?ten, erw?rmen, beleuchten ? freiraum-datenbertragung ? energiebertragung ? test- und messsysteme sicherhei...die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?... |
| Description |
Laser TO220 850 nm
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| File Size |
79.95K /
7 Page |
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it Online |
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APLUS[Apuls Intergrated Circuits]
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| Part No. |
APR9301-V2-1
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| OCR Text |
... AGC M icRef M icIn VccA_R VccA_L 0.1uF 47u 1K
APR9301-V2
VC C(6VDC)
For low power applications use double pole switch.
V CC VCC 150...Die Bonding Pad Diagram
/C
APR9301-V2
Notes:
N
V
CC D CC
Bonding Pad Diagram & Descriptio... |
| Description |
SINGLE-CHIP VOICE RECORDING & PLAYBACK DEVICE FOR SINGLE 20 TO 30 SECOND MESSAGE
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| File Size |
389.14K /
7 Page |
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it Online |
Download Datasheet
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Price and Availability
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