|
|
 |
WEDC[White Electronic Designs Corporation]
|
Part No. |
WV3DG7266V7D1 WV3DG7266V10D1 WV3DG7266V75D1 WV3DG7266V-D1
|
OCR Text |
... Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
TA = 25C, f = 1MHz, VCC = 3.3V, VREF = 1.4V 200mV
Parameter Input Capacitance (A0-A12) Input Capacitance (RAS#,CAS#... |
Description |
512MB -2x32Mx72 SDRAM, UNBUFFERED, w/PLL
|
File Size |
141.67K /
8 Page |
View
it Online |
Download Datasheet
|
|
|
 |

Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
|
Part No. |
MR16R082GBN1 MR16R082CGBN1-CK8 MR16R0824BN1 MR16R0824BN1-CG6 MR16R0824BN1-CK7 MR16R0824BN1-CK8 MR16R0826BN1 MR16R0826BN1-CG6 MR16R0826BN1-CK7 MR16R0826BN1-CK8 MR16R0828BN1 MR16R0828BN1-CG6 MR16R0828BN1-CK7 MR16R0828BN1-CK8 MR16R082CGBN1-CG6 MR16R082CGBN1-CK7 MR16R082CBN1
|
OCR Text |
...erved fRAS[11:8] fRAS[7:0] PMAX,HI, PMAX,LO, Tj HeatSpreader, thermal sensor, Tplate PSTBY,HI PACTI,HI PACTRW,HI PSTBY,LO PACTI,LO PACTRW,LO...SPD specification 1.0 2. It is reserved to future use (RFU). 3. Unit is not available ( n/a). 4. The... |
Description |
(MR16R0824(6/8/C/G)BN1) RAMBUS MODULE RAMBUS MODULE Rambus的模
|
File Size |
37.07K /
4 Page |
View
it Online |
Download Datasheet
|
|

Price and Availability
|