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  GRM4.4422.123 Datasheet PDF File

For GRM4.4422.123 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0736442216

Molex Electronics Ltd.
Part No. 0736442216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 174.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 68604-422HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736442217

Molex Electronics Ltd.
Part No. 0736442217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 174.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136647-044222LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 30u\\ Gold (Tin on Tails) plating, Black Color, 4 Positions, Non GW Compatible, with out Posts, Tray packing.
Tech specs    

Official Product Page

    0739442216

Molex Electronics Ltd.
Part No. 0739442216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderGuide Pin Option, 72 Circuits

File Size 153.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 93944-422HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736442214

Molex Electronics Ltd.
Part No. 0736442214
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position H, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-184422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

    0736442212

Molex Electronics Ltd.
Part No. 0736442212
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-084422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
Tech specs    

Official Product Page

    73644-2210 0736442210

Molex Electronics Ltd.
Part No. 73644-2210 0736442210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits

File Size 174.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-144422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 140 Positions.
Tech specs    

Official Product Page

    0520442245 52044-2245

Molex Electronics Ltd.
Part No. 0520442245 52044-2245
Description 1.25mm (.049") Right Angle, Non-ZIF, Top Contact Style Receptacle, 22 Circuits
1.25mm (.049) Right Angle, Non-ZIF, Top Contact Style Receptacle, 22 Circuits

File Size 126.44K  /  2 Page

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Amphenol Communications Solutions

Part No. 69144-220LF
Description Low Profile Jumper , Single Row, Multi Position Busbar , 20 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0459854422

Molex Electronics Ltd.
Part No. 0459854422
Description 1.27mm (.050), 12.00mm (.472) Pitch, EXTreme LPHPower Header, Right Angle, 4 Power Contacts, 16 Signal Contacts, Select Gold (Au) Plating, for 2.36mm (.093) Thick PC Board

File Size 433.17K  /  7 Page

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Amphenol Communications Solutions

Part No. 68004-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs    

Official Product Page

    0528304422 52830-4422

Molex Electronics Ltd.
Part No. 0528304422 52830-4422
Description Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free

File Size 112.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 68024-422HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
Tech specs    

Official Product Page

    ELM14422AA-N

ELM Technology Corporation
Part No. ELM14422AA-N
Description Single N-channel MOSFET

File Size 83.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-164422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

For GRM4.4422.123 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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