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Fairchild Semiconductor, Corp. FAIRCHILD[Fairchild Semiconductor]
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Part No. |
HUF75309T3ST
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OCR Text |
... thermal resistance of the heat dissipating path determines the maximum allowable device power dissipation, PD(MAX), in an application. Therefore the application's ambient temperature, TA (oC), and thermal impedance RJA (oC/W) must be revie... |
Description |
3A, 55V, 0.070 Ohm, N-Channel UltraFET Power MOSFET 3 A, 55 V, 0.07 ohm, N-CHANNEL, Si, POWER, MOSFET
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File Size |
181.08K /
9 Page |
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it Online |
Download Datasheet
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Sanyo
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Part No. |
LA4192
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OCR Text |
... in the vicinity of the IC heat dissipating plate should be made as broad in area as possible when designing the printed circuit board. For the sample printed pattern shown earlier, providing copper coil where indicated by the broken lines ... |
Description |
Monolithic Linear IC
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File Size |
405.56K /
11 Page |
View
it Online |
Download Datasheet
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Price and Availability
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