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				Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FMA219
OCR Text	...ptimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with some degradation in thermal de-rating performance (PTOT = 550mW) * Note on Thermal Resistivity: The nominal value of 250C/W is stated for ...
Description	X-BAND LNA MMIC
File Size	325.92K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC44806
OCR Text	...ne way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to t...
Description	GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT
File Size	315.34K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC44907
OCR Text	...ne way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to t...
Description	GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT
File Size	253.92K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC46006
OCR Text	...1 Low frequency termination. attach bypass capacitor per application circuit herein. 4 RFOUT This pad is DC coupled and matched to 50 Ohms from DC - 20.0 GHz 5 ACG2 Low frequency termination. attach bypass capacitor per...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, DC - 20.0 GHz
File Size	392.96K / 8 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC424
OCR Text	... way to accom- plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should brought as close to th...
Description	Space Applications
File Size	891.10K / 9 Page	View it Online	Download Datasheet

				RF Micro Devices
Part No.	NBB-302-E NBB-302-T1 NBB-3021
OCR Text	...0 322 Application Notes Die attach The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to the trace on which the chip is mounted, and establishes the thermal pa...
Description	CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz
File Size	315.58K / 8 Page	View it Online	Download Datasheet

				Analog Microelectronics
Part No.	AME5140AEQAADJY AME5140BEQAADJZ AME5140AEQAADJZ3 AME5140AEEAADJY AME5140AEEAADJZ3 AME5140AEQVADJY AME5140AEQVADJZ3 AME5140 AME5140AEEVADJY AME5140AEEVADJZ AME5140AEEVADJZ3 AME5140AEVAADJY AME5140AEVAADJZ-3 AME5140AEVAADJZ3 AME5140AEVVADJY AME5140AEVVADJZ3
OCR Text	...5. SW 6. SW 7. GND 8. GND * Die attach: Conductive Epoxy 1 2 3 1 2 3 4 * Die attach: Conductive Epoxy DFN-8 (3mmx3mmx0.75mm) Top View 8 7 6 5 AME5140AEVA 1. NC 2. FB 3. NC AME5140 4. SW 5. NC 6. IN 7. EN...
Description	1.6 MHz Boost Converter With 30V Internal FET Switch
File Size	209.68K / 22 Page	View it Online	Download Datasheet

				AMETHERM Circuit Protection Thermistors Analog Microelectronics
Part No.	AME8844AEQA150Z AME8844AEQA180 AME8844AEQA180Z AME8844AEQA250Z AME8844AEQA330Z AME8844BEQAADJ AME8844BEQAADJZ AME884407 AME8844-07
OCR Text	... GND 6. GND 7. GND 8. GND * Die attach: Conductive Epoxy AME8844 4. OUT 5. GND 6. GND 7. GND 8. GND * Die attach: Conductive Epoxy 1 2 3 4 1 2 3 4 n Pin Description Pin Number Pin Name AME8844AEQA AME8844BE...
Description	750mA CMOS LDO
File Size	165.08K / 15 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH509
OCR Text	...ompatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment...
Description	GaAs HEMT LOW NOISE AMPLIFIER, 71 - 86 GHz
File Size	188.52K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH102
OCR Text	...ne way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to t...
Description	GaAs HEMT MMIC WIDEBAND LOW NOISE AMPLIFIER, 2 - 20 GHz
File Size	177.32K / 6 Page	View it Online	Download Datasheet

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