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T800206 3SK29107 H1086NL BAMCD23 D1376K ON1656 30011 PA035XSL
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  87834-4092 Datasheet PDF File

For 87834-4092 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-4013 0878344013

Molex Electronics Ltd.
Part No. 87834-4013 0878344013
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating

File Size 94.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-409241000LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878341095

Molex Electronics Ltd.
Part No. 0878341095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 55714-092LF
Description 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    0878341219

Molex Electronics Ltd.
Part No. 0878341219
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 12 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 114.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-409261750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87834-1621 0878341621

Molex Electronics Ltd.
Part No. 87834-1621 0878341621
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 10140923-102LF
Description AirMAX VS2®, Backplane Connectors, 3-Pair, 8 Column, 72-Position, 2.0mm, , Right Angle Header, Press-Fit
Tech specs    

Official Product Page

    0878341045

Molex Electronics Ltd.
Part No. 0878341045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-409241700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0878340619

Molex Electronics Ltd.
Part No. 0878340619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 6 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCBLocator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-409241750LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87834-0621 0878340621

Molex Electronics Ltd.
Part No. 87834-0621 0878340621
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-409261750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0878341021

Molex Electronics Ltd.
Part No. 0878341021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-409261850LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-0411 0878340411

Molex Electronics Ltd.
Part No. 87834-0411 0878340411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 4 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-409261800LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-2041 0878342041

Molex Electronics Ltd.
Part No. 87834-2041 0878342041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136654-0922TLF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Gold Flash plating, 9 Positions, Black Color, Non GW Compatible LCP, Tape and Reel.
Tech specs    

Official Product Page

For 87834-4092 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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