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Amphenol Communications Solutions |
| Part No. |
68015-202HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800181 70567-0007 A-70567-0007 15-80-0181
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68015-218HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0011 A-70567-0011 0015800261
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68015-234HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 34 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800169 15-80-0169 A-70567-0278
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-801-52LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 52 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800165 15-80-0165 70567-0142 A-70567-0142
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
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| File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86840-152HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 52 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800147 15-80-0147 A-70567-0209
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
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| File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68015-211HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 11 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0363 15-80-1501 0015801501
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68015-227HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 27 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-208
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68015-214HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0069 0015800069 A-70567-0273
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
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| File Size |
1,218.56K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68015-231HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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