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Intersil
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| Part No. |
5962F9670701VXC 5962F9670701VRC
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.4 mils x 4.4 mils
Metallization Mask Layout
ACS245MS
A0 (2) DIR (1) VCC (20) VCC ... |
| Description |
Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver
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| File Size |
80.38K /
4 Page |
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it Online |
Download Datasheet
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INTERSIL[Intersil Corporation]
Intersil, Corp.
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| Part No. |
ACTS244D ACTS244HMSR FN3187 ACTS244MS 5962F9671801VRC 5962F9671801VXC ACTS244K
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110 x 110 (m) 4.4 x 4.4 (mils)
Metallization Mask Layout
ACTS244MS
AI1 (2) AE (1) VCC (20) VCC ... |
| Description |
From old datasheet system
Radiation Hardened Octal Non-Inverting Three-State Buffer ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, UUC20
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| File Size |
46.75K /
3 Page |
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it Online |
Download Datasheet |
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INTERSIL[Intersil Corporation]
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| Part No. |
ACS245MS FN3198 ACS245D ACS245HMSR ACS245K
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.4 mils x 4.4 mils
Metallization Mask Layout
ACS245MS
A0 (2) DIR (1) VCC (20) VCC ... |
| Description |
Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver
From old datasheet system
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| File Size |
75.26K /
3 Page |
View
it Online |
Download Datasheet |
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Intersil
|
| Part No. |
ACTS573HMSR
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110m x 110m
Metallization Mask Layout
ACTS573MS
(20) VCC
(19) Q0
... |
| Description |
Radiation Hardened Octal Three-State Transparent Latch
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| File Size |
49.11K /
4 Page |
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it Online |
Download Datasheet |
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HARRIS SEMICONDUCTOR
Intersil, Corp.
INTERSIL[Intersil Corporation]
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| Part No. |
ACTS541D ACTS541HMSR FN4094 ACTS541MS 5962F9672601VRC 5962F9672601VXC ACTS541K
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110m x 110m
Metallization Mask Layout
ACTS541MS
(20) VCC
(19) OE2
... |
| Description |
Radiation Hardened Octal Three-State Buffer/Line Driver 辐射加固八路三态缓冲器/线路驱动
From old datasheet system
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| File Size |
65.37K /
3 Page |
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it Online |
Download Datasheet |
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INTERSIL[Intersil Corporation]
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| Part No. |
ACTS74HMSR ACTS74MS 5962F9671301VCC 5962F9671301VXC ACTS74D ACTS74K
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.3 mils x 4.3 mils
Metallization Mask Layout
ACTS74MS
D1 (2)
R1 (1)
VCC (14... |
| Description |
ACT SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14
Radiation Hardened Dual D Flip Flop with Set and Reset
D-Flip Flop, Dual, with Set and Reset, TTL Inputs, Rad-Hard, Advanced Logic, CMOS
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| File Size |
103.89K /
3 Page |
View
it Online |
Download Datasheet |
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|
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Intersil
|
| Part No. |
ACS573HMSR
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| OCR Text |
... 1.125kA Metal 2 Thickness: 9kA 1ka GLASSIVATION: Type: SiO2 Thickness: 8kA 1ka WORST CASE CURRENT DENSITY: <2.0 x 105 A/cm2 BOND PAD SIZE: > 4.3 mils x 4.3 mils > 110m x 110m
Metallization Mask Layout
ACS573MS
(20) VCC
(19) Q0
... |
| Description |
Radiation Hardened Octal Three-State Transparent Latch
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| File Size |
49.13K /
5 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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