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235025P KGF1165 V2262 DS1511W 74LCX16 MMBFJ109 VHE2608 IN1489A
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  1008-180K Datasheet PDF File

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    XB1008-BD10

Mimix Broadband
Part No. XB1008-BD10
Description 10.0-21.0 GHz GaAs MMIC
File Size 1,242.19K  /  5 Page

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Amphenol Communications Solutions
Part No. 10080054-110LF
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
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HUA FENG CIRCUIT





    GOWANDA ELECTRONICS CORP
Part No. CC1008-330K
Description 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size 27.46K  /  2 Page

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Amphenol Communications Solutions
Part No. 10080054-037LF
Description Quickie Header, Wire to Board Connector, Double Row, 14 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

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    1008AF-103X-L-

Coilcraft lnc.
Part No. 1008AF-103X-L-
Description Chip Inductors
File Size 345.79K  /  2 Page

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Amphenol Communications Solutions
Part No. 10082378-10113TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

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    0001.1004.PT 0001.1008.PT 0001.1006.TR 0001.1001.TR 0001.1007.PT

Schurter Inc.
Part No. 0001.1004.PT 0001.1008.PT 0001.1006.TR 0001.1001.TR 0001.1007.PT
Description Miniature Fuse with Pigtail, 5.4 x 22.5 mm, Quick-Acting F, H, 250 VAC
File Size 242.90K  /  3 Page

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Amphenol Communications Solutions
Part No. 10080054-025LF
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

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    XD1008-BD-000V XD1008-BD-EV1

Mimix Broadband
Part No. XD1008-BD-000V XD1008-BD-EV1
Description 30 kHz - 40 GHz GaAs MMIC Distributed Amplifier
File Size 333.72K  /  10 Page

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Amphenol Communications Solutions
Part No. 10080054-080LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

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    MIMIX[Mimix Broadband]
Part No. XB1008-BD-000V XB1008-BD XB1008-BD-EV1
Description 10.0-21.0 GHz GaAs MMIC Buffer Amplifier
File Size 233.06K  /  9 Page

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Amphenol Communications Solutions
Part No. 10082378-10003TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

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    S9973-1007 S9973-1008 S9972-1007 S9972-1008 S9972

Hamamatsu Corporation
Part No. S9973-1007 S9973-1008 S9972-1007 S9972-1008 S9972
Description CCD area image sensor Front-illuminated FFT-CCD, high IR sensitivity
File Size 163.05K  /  9 Page

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Amphenol Communications Solutions
Part No. 10082274-101LF
Description Pwr Profile® , Power connector, 2P Header, Right Angle, STB, 20AMP per contact
Tech specs 　 　

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    IFSC-1008AB-ER-4R7-M-01

Vishay Siliconix
Part No. IFSC-1008AB-ER-4R7-M-01
Description Low Profile, High Current Inductors
File Size 85.08K  /  2 Page

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Amphenol Communications Solutions
Part No. 10083182-110LF
Description 5 Row, 60 Posn Signal Header, Straight Solder to Board without Plastic Posts
Tech specs 　 　

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    MS1008 MS1009

Microsemi Corporation
Part No. MS1008 MS1009
Description (MS1008 / MS1009) 10 AMP SCHOTTKY BARRIER RECTIFIER
File Size 149.39K  /  2 Page

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Amphenol Communications Solutions
Part No. 10084155-101LF
Description ZipLine® Right Angle Receptacle Assembly 6-Pair, 16 IMLA, 1.8 m
Tech specs 　 　

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    MS1009 MS1008

MICROSEMI[Microsemi Corporation]
Part No. MS1009 MS1008
Description 10 Amp Schottky Barrier Rectifiers
File Size 119.85K  /  2 Page

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Amphenol Communications Solutions
Part No. 10080054-013LF
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
Tech specs 　 　

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