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  XG8S-0331 Datasheet PDF File

For XG8S-0331 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    75757-0331 0757570331

Molex Electronics Ltd.
Part No. 75757-0331 0757570331
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Rochester Electronics LLC

Part No. 100331/VYA
Description 100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    9503310000

List of Unclassifed Manufacturers
ETC[ETC]
Part No. 9503310000
Description Rail Mounted Terminal Blocks

File Size 93.13K  /  2 Page

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Amphenol Communications Solutions

Part No. 68033-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

   
Part No. E_030331_95CW64_SUMMARY
Description From old datasheet system

File Size 1,135.70K  /  21 Page

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Amphenol Communications Solutions

Part No. 68033-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    0643203318 64320-3318

Molex Electronics Ltd.
Part No. 0643203318 64320-3318
Description .635mm (.025), 1.50mm (.059), CMC Receptacle, 48 Circuits, Right Wire OutputGray Coding, Mat Sealed
.635mm (.025"), 1.50mm (.059"), CMC Receptacle, 48 Circuits, Right Wire OutputGray Coding, Mat Sealed

File Size 1,273.94K  /  5 Page

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Amphenol Communications Solutions

Part No. 10106813-033112LF
Description 0.5 mm Pitch Hermaphroditic Mezzanine Connector, 30 positions, Standard length with pegs and hold-downs, Half of mated height equals 3 mm
Tech specs    

Official Product Page

    0643203315

Molex Electronics Ltd.
Part No. 0643203315
Description .635mm (.025), 1.50mm (.059), CMC Receptacle, 48 Circuits, Right Wire OutputGreen Coding, Mat Sealed
.635mm (.025"), 1.50mm (.059"), CMC Receptacle, 48 Circuits, Right Wire OutputGreen Coding, Mat Sealed

File Size 1,273.94K  /  5 Page

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Amphenol Communications Solutions

Part No. 74033-103LF
Description 74033-103LF-BLACK 30AU LF
Tech specs    

Official Product Page

    0643203319 64320-3319

Molex Electronics Ltd.
Part No. 0643203319 64320-3319
Description .635mm (.025), 1.50mm (.059), CMC Receptacle, 48 Circuits, Right Wire Output,Brown Coding, Mat Sealed
.635mm (.025"), 1.50mm (.059"), CMC Receptacle, 48 Circuits, Right Wire Output,Brown Coding, Mat Sealed

File Size 1,274.60K  /  5 Page

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Amphenol Communications Solutions

Part No. UE86L462700331
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4SFP EXP PRT LRGR LP DIA.
Tech specs    

Official Product Page

    0643203311 64320-3311

Molex Electronics Ltd.
Part No. 0643203311 64320-3311
Description .635mm (.025), 1.50mm (.059), CMC Receptacle, 48 Circuits, Right Wire OutputBlack Coding, Mat Sealed
.635mm (.025"), 1.50mm (.059"), CMC Receptacle, 48 Circuits, Right Wire OutputBlack Coding, Mat Sealed

File Size 1,752.95K  /  8 Page

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Amphenol Communications Solutions

Part No. 68000-331HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 31 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    0901303310 90130-3310

Molex Electronics Ltd.
Part No. 0901303310 90130-3310
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-115HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    85003-3108 0850033108

Molex Electronics Ltd.
Part No. 85003-3108 0850033108
Description 2.54mm (.100) Pitch DIN 41612 C/2 Style Male Header, Right Angle, Through Hole, 0.80渭m (32渭) Selective Gold (Au) Plating, 48 Circuits, without Mounting Clips
2.54mm (.100) Pitch DIN 41612 C/2 Style Male Header, Right Angle, Through Hole, 0.80μm (32μ) Selective Gold (Au) Plating, 48 Circuits, without Mounting Clips

File Size 60.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136647-033121LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs    

Official Product Page

    0901303312

Molex Electronics Ltd.
Part No. 0901303312
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 68033-135HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

For XG8S-0331 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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