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ONSEMI[ON Semiconductor]
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| Part No. |
TRA3225 TRA3225-D TRA3225/D
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| OCR Text |
...at Sink Material)
TENSION
shear
Exceeding these recommended maximums can result in electrical degradation of the device.
Soldering
The base heat sink may be of various materials whose shape and size are a function of the indivi... |
| Description |
Medium-Current Silicon Rectifier 中等电流硅整
Medium - Current Silicon Rectifier
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| File Size |
71.20K /
8 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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| Part No. |
TRA2532 TRA2532-D
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| OCR Text |
...at Sink Material)
TENSION
shear
Exceeding these recommended maximums can result in electrical degradation of the device.
Soldering
The base heat sink may be of various materials whose shape and size are a function of the indivi... |
| Description |
Overvoltage Transient Suppressor
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| File Size |
61.83K /
8 Page |
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it Online |
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RFM[RF Monolithics, Inc]
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| Part No. |
SF1092A
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| OCR Text |
...k Destructive Bond Strength Die shear Strength
1,500g Max. 5 Shocks 3 Axis
Wire Bond Pull Strength 2.0 grams (After Seal) 0.6 kg (Strength/area limit in development) >95% wetted surface Within specifications Within specifications 8 oz. ... |
| Description |
199 MHz SAW Filter
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| File Size |
222.09K /
9 Page |
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it Online |
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椋???″????浣?涓??)??????
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| Part No. |
MPXV5010D
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| OCR Text |
... to +125 c ? patented silicon shear stress strain gauge ? available in differential and gauge configurations ? available in surface mount (smt) or through-hole (dip) configurations application examples ? hospital beds ?hvac ? respiratory ... |
| Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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| File Size |
438.93K /
18 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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| Part No. |
MR2510 MR2502 MR2504 MR2500-D
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| OCR Text |
... 6-inch lbs. 0.68 Newton-meters shear 55 lbs. 244.7 Newton MECHANICAL STRESS
COMPRESSION
The button rectifier is basically a semiconductor chip bonded between two nickel-plated copper heat sinks with an encapsulating material of thermal... |
| Description |
25A 1000V Silicon Rectifier
Medium-Current Silicon Rectifiers
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| File Size |
91.78K /
8 Page |
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it Online |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MPXV7007GP MPXV7007DP MPXV7007G MPXV7007GC6T1 MPXV7007GC6U
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| OCR Text |
...r -40 to +125C Patented Silicon shear Stress Strain Gauge Available in Differential and Gauge Configurations
MPXV7007G SERIES
INTEGRATED PRESSURE SENSOR -7 to 7 kPa (-1 to 1 psi) 0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGE
MPXV7007GC6U... |
| Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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| File Size |
125.34K /
12 Page |
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it Online |
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FREESCALE SEMICONDUCTOR INC
FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MPXV7002GP MPXV7002 MPXV7002DP MPXV7002GC6T1 MPXV7002GC6U MPXV7002DPT1
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| OCR Text |
...er +10 to +60C Patented Silicon shear Stress Strain Gauge Available in Differential and Gauge Configurations Hospital Beds HVAC Respiratory Systems Process Control ORDERING INFORMATION
Device Type Options Case No. 482A 482A 1369 1351 1351 ... |
| Description |
DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, -.29-0.29Psi, 6.25%, 2.50-4.50V, SQUARE, SURFACE MOUNT
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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| File Size |
322.57K /
10 Page |
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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MPX5999D
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| OCR Text |
...-Based Systems Patented Silicon shear Stress Strain Gauge Durable Epoxy Unibody Element ORDERING INFORMATION(1)
Device Type Basic Element Options Differential Case Type 867 MPX Series Order Number MPX5999D Device Marking MPX5999D 1 2 3
... |
| Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
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| File Size |
158.56K /
8 Page |
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it Online |
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Ablestik
ETC[ETC]
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| Part No. |
2815A
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| OCR Text |
...ANICAL PROPERTIES Post Cure Die shear Strength @ 25C Die shear Strength (kgf/die) vs. Temperature Chip Warpage @ 25C vs. Chip Size ABLEBOND 2815A Test Description Test Method
9900 MPa (1,400,000 psi) Dynamic mechanical thermal 5700 MPa (... |
| Description |
THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE
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| File Size |
317.05K /
3 Page |
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it Online |
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ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
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| Part No. |
145
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| OCR Text |
...ysis (Cpk) Bond pull test, Bond shear test. 2.1.7 Non critical parameters analysis (Mean)
yes [X ]
no [ ]
N/A [ ]
Note 1: as described in related ADCS procedure
2.2 Test Vehicles (TV) description. Line
0431* 0158* 0082*
S... |
| Description |
PRODUCT/PROCESS CHANGE NOTIFICATION
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| File Size |
429.29K /
12 Page |
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it Online |
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Price and Availability
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