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MACOM[Tyco Electronics]
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| Part No. |
MA4BPS201 MA4BPS301 MA4BPS101
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| OCR Text |
...et should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer's schedule. Wire Bonding The two bond pads on these die have a Ti-Pt-Au metalization scheme, with a final gold thickness of 2.5 microns. The ... |
| Description |
PIN Diode Chips with Offset Bond Pads
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| File Size |
83.37K /
4 Page |
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it Online |
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ZCOMM[Z-Communications, Inc]
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| Part No. |
CRO2343A-L CRO2343A-LF
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| OCR Text |
...IUS OF ALL 16 HALF HOLES AT THE perimeter OF THE BOARD ARE PLATED TO PROVIDE A SURFACE FOR THE ATTACHMENT OF THE VCO TO A PCB, IN 13 LOCATIONS, WITH 3 PADS BEING USED FOR ELECTROMECHANICAL INTERFACE. 16 SOLDER LOCATIONS REQUIRED. 2. THE SUR... |
| Description |
VOLTAGE CONTROLLED OSCILLATOR
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| File Size |
90.54K /
2 Page |
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it Online |
Download Datasheet |
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美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC363
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| OCR Text |
...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi... |
| Description |
GaAs HBT MMIC DIVIDE-BY-8/ DC - 12.0 GHz
GaAs HBT MMIC DIVIDE-BY-8 DC - 12.0 GHz
GaAs HBT MMIC DIVIDE-BY-8, DC - 12.0 GHz
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| File Size |
186.29K /
6 Page |
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it Online |
Download Datasheet |
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TI
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| Part No. |
OMAP5910JG OMAP5910JGDY2
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| OCR Text |
...ression standards) Boundary and perimeter Computation (useful for Machine Vision applications) Image Threshold and Histogram Computations (useful for various Image Analysis applications)
72 120
Revised Table 3-17 to change access widt... |
| Description |
Applications Processor
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| File Size |
1,925.55K /
169 Page |
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it Online |
Download Datasheet |
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SILABS
SSOUSA[Solid State Optronic]
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| Part No. |
SI5364-EVB
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| OCR Text |
...Si5364 device are routed to the perimeter of the circuit board using 50 transmission structures. The capacitors that provide accoupling are located near the clock output SMA connectors.
Internal Regulator Compensation
The Si5364-EVB co... |
| Description |
EVALUATION BOARD FOR Si5364 SONET/SDH PRECISION PORT CARD CLOCK IC
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| File Size |
1,233.67K /
14 Page |
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it Online |
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Xilinx
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| Part No. |
XC2S15-6VQ100C
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| OCR Text |
... Blocks (CLBs), surrounded by a perimeter of programmable Input/Output Blocks (IOBs). There are four Delay-Locked Loops (DLLs), one at each corner of the die. Two columns of block RAM lie on opposite sides of the die, between the CLBs and t... |
| Description |
IC,FPGA,432-CELL,CMOS,TQFP,100PIN,PLASTIC
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| File Size |
57.66K /
5 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MADA2030G
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| OCR Text |
...et should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used but is not required.
VinHi VinHi VinLow VinHi VinLow Vin Low VinLow VinHi VinHi Vi... |
| Description |
5-Bit GaAs Digital Attenuator DC - 2 GHz
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| File Size |
97.83K /
2 Page |
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it Online |
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Price and Availability
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