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TAK Cheong Electronics
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Part No. |
FV-1043
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OCR Text |
...
Specification Features:
DO-35 Package (JEDEC)
DEVICE MARKING DIAGRAM
Through-Hole Device Type Mounting Hermetically Sealed Glass Compression Bonded Construction All external surfaces are corrosion resistant and leads are readily sol... |
Description |
Diodes
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File Size |
217.94K /
6 Page |
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it Online |
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Microsemi
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Part No. |
1N5610E3 1N5611E3 1N5612E3
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OCR Text |
...ilable in a surface mount melf package configuration as a special order. microsemi also offers numerous other tvs products to meet higher...glass package. ? jan , jan tx , and jantxv military qualifications available per mil - prf - 19... |
Description |
Standard Unidirectional and Bidirectional TVS
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File Size |
148.38K /
4 Page |
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it Online |
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Microsemi
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Part No. |
1N649-1 1N647UR-1 1N645UR-1
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OCR Text |
Package
Used as a general purpose rectifier in power supplies, or for clipping and steering applications. High performance alternative to...glass 0.458-0.558 mm Metallurgically bonded Thermally matched system D ia . 1 .0 " L e n g th No the... |
Description |
Standard Rectifier (trr more than 500ns)
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File Size |
172.35K /
4 Page |
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it Online |
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New Jersey Semiconductors
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Part No. |
1N4986B
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OCR Text |
...aximum ratings ? microminiature package operating temperature: - 66c to + 175c ? voidless hermetically sealed glass package storage temperature: -65bc to +200c ? triple layer passivation ? metallurgical^ bonded ? high performance characteri... |
Description |
Diode Zener Single 150V 5W 2-Pin Case 5W
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File Size |
84.38K /
2 Page |
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it Online |
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Price and Availability
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